Abstract:Electrochemical CO2 reduction is a promising strategy for the utilization of CO2 and intermittent excess electricity. Cu is the only single metal catalyst that can electrochemically convert CO2 into multicarbon products. However, Cu exhibits an unfavorable activity and selectivity for the generation of C2 products because of the insufficient amount of CO* provided for the C-C coupling. Based on the strong CO2 adsorption and ultrafast reaction kinetics of CO* formation on Pd, an intimate CuPd(100) interface was designed to lower the intermediate reaction barriers and improve the efficiency of C2 product formation. Density functional theory (DFT) calculations showed that the CuPd(100) interface enhanced the CO2 adsorption and decreased the CO2* hydrogenation energy barrier, which was beneficial for the C-C coupling. The potential-determining step (PDS) barrier of CO2 to C2 products on the CuPd(100) interface was 0.61 eV, which was lower than that on Cu(100) (0.72 eV). Encouraged by the DFT calculation results, the CuPd(100) interface catalyst was prepared by a facile chemical solution method and characterized by transmission electron microscopy. CO2 temperature-programmed desorption and gas sensor experiments further confirmed the enhancement of the CO2 adsorption and CO2* hydrogenation ability of the CuPd(100) interface catalyst. Specifically, the obtained CuPd(100) interface catalyst exhibited a C2 Faradaic efficiency of 50.3% ± 1.2% at −1.4 VRHE in 0.1 M KHCO3, which was 2.1 times higher than that of the Cu catalyst (23.6% ± 1.5%). This study provides the basis for the rational design of Cu-based electrocatalysts for the generation of multicarbon products by fine-tuning the intermediate reaction barriers.A CuPd(100) catalyst was designed and fabricated to improve the selectivity of the electroreduction of CO2 to C2 products by tuning the CO2 adsorption ability and intermediate reaction barriers.

Electrochemical Investigation of Pd-Free Electroless Co-Based Capping Layers on Cu Surfaces

Characterization of Pd-free Electroless Co-based Cap Selectively Deposited on Cu Surface Via Borane-Based Reducing Agent

Selectivity Enhancement of Electroless Co Deposition for Cu Capping Process via Spontaneous Diazonium Ion Reduction

Direct copper plating on ultra-thin sputtered cobalt film in an alkaline bath

Manipulating Cu Nanoparticle Surface Oxidation States Tunes Catalytic Selectivity Toward CH4 or C2+ Products in CO2 Electroreduction

Long-term stability of Cu/Pd nanoparticles and their feasibility for electroless copper deposition

Electrochemical CO<sub>2</sub>reduction on Pd-modified Cu foil

Pd Nanoparticles As a New Activator for Electroless Copper Deposition

Synthesis of PVP stabilized Cu/Pd nanoparticles with citrate complexing agent and its application as an activator for electroless copper deposition

Mechanistic Study of Ag/Pd-PVP Nanoparticles and Their Functions As Catalyst for Electroless Copper Deposition

Stabilization of Pd0 by Cu Alloying: Theory‐Guided Design of Pd3Cu Electrocatalyst for Anodic Methanol Carbonylation

Electrodeposition of Extremely Cu-Rich CuPd Bimetallic Nanoparticles from an Amide-Type Hydrophobic Protic Ionic Liquid

Operando Investigation of the Origin of C─C Coupling in Electrochemical CO2 Reduction Upon Releasing Bonding Strength, Structural Ordering in Pd─Cu Catalyst

Synthesis of Hydrophilic and Hydrophobic Pd Nanoparticles with in Situ Generated Reducing Agent and Their Application As Activator for Electroless Copper and Nickel Depositions

Preanodized Cu Surface for Selective CO2 Electroreduction to C1 or C2+ Products

Tuning the intermediate reaction barriers by a CuPd catalyst to improve the selectivity of CO2 electroreduction to C2 products

Chemical preparation of Pd nanoparticles in room temperature ethylene glycol system and its application to electroless copper deposition

Modification of Cu Nanoparticles with A Disulfide for Polyimide Metallization

Electrochemical Surface Modification on CuPdAu/C with Extraordinary Behavior Toward Formic Acid/formate Oxidation

Study on Chemical Activity of Electroless Copper Plating

Tuning the intermediate reaction barriers by CuPd catalyst to improve the selectivity of electroreduction CO2 to C2 products