Synthesis of Hydrophilic and Hydrophobic Pd Nanoparticles with in Situ Generated Reducing Agent and Their Application As Activator for Electroless Copper and Nickel Depositions

CL Lee,YC Huang,CC Wan,YY Wang,YJ Ju,LC Kuo,JC Oung
DOI: https://doi.org/10.1149/1.1937977
IF: 3.9
2005-01-01
Journal of The Electrochemical Society
Abstract:A novel method to selectively prepare hydrophilic (hy-Pd-nm) or hydrophobic Pd (hp-Pd-nm) nanoclusters simply by regulating reflux time has been developed. By this method, uniform Pd nanoclusters, well-dispersed in aqueous or organic solvents, can be obtained. Both hy-Pd-nm and hp-Pd-nm can be used successfully as activators for electroless metal deposition. The surface modifications of the hydrophilic and hydrophobic Pd nanoparticles both display a short induction period for catalyzing electroless nickel (EN) bath due to protection- agent inhibited adsorption of the reducing agent of a neutral EN bath. In an alkaline electroless copper (EC) bath, hy-Pd-nm easily catalyzes in the bath and has a faster deposition rate compared with hp-Pd-nm because the surfactant, sodium dodecyl sulfate (SDS), could be repulsive and desorbed by OH-. Finally, the electroless copper deposition rate was found to increase if SDS concentration was decreased. (c) 2005 The Electrochemical Society. [DOI: 10.1149/1.1937977] All rights reserved.
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