Abstract:Palladium nanoparticles were synthesized simply by reducing Pd ions which were attracted to electron nitrogen atom in poly(N-vinyl-2-pyrrolidone) (PVP). This Pd/PVP aqueous system was developed as the activator for electroless copper deposition. Compared with commercial Pd/Sn colloid that was easily oxidized by dissolved oxygen and agglomerated in the solution, Pd/PVP activator was stable without any Pd aggregation for a long time. Pd/PVP activator showed high catalytic activity as Pd/Sn colloid on flat FR-4 substrate (glass fiber reinforced epoxy). From back-light test for printed-through-hole (PTH) process, we found that micro-etching-process would reduce catalytic activity of Pd/PVP activator and voids in PTH occurred especially on glass fiber. Adding phosphoric acid to Pd/PVP activator could improve back-light performance, but Pd nanoparticles precipitated in a few days. In this study, we found that H3PO4 molecule was the cause of Pd agglomeration by forming hydrogen bond with PVP. Pd nanoparticles would precipitate if the concentration of H3PO4 were high in the solution. IR spectra and UV-vis spectra proved that Pd/PVP activator would react with H3PO4 molecules to form a complex by hydrogen bond, and DLS analysis also showed that Pd/PVP/H3PO4 nanoparticles formed a larger hydrolysis cluster than Pd/PVP nanoparticles. TEM images gave the information about particle size and shape of Pd nanoparticles, and more information about dispersion and distance of Pd nanoparticles and Pd clusters could be obtained by the model fitting of SAXS data. The results showed that Pd/PVP/H3PO4 nanoparticles formed a looser structure than Pd/PVP nanoparticles. Since there is higher Cu deposition on epoxy when we use Pd/PVP/H3PO4 nanoparticles as activator, in PTH process, Cu deposition on glass fiber is improved by Cu deposition on epoxy nearby. So back-- light performance become acceptable for PCBs industry.

Study of the Adsorptive Behavior of Pd/PVP Nanoparticles and Its Interaction with Conditioner in Electroless Copper Deposition

The Study of the Stability of Pd/PVP Nanoparticles Added with Phosphoric Acid and the Activity to Electroless Cu Deposition

Long-term stability of Cu/Pd nanoparticles and their feasibility for electroless copper deposition

Mechanistic Study of Ag/Pd-PVP Nanoparticles and Their Functions As Catalyst for Electroless Copper Deposition

Synthesis of PVP stabilized Cu/Pd nanoparticles with citrate complexing agent and its application as an activator for electroless copper deposition

Synthesis and Characterization of Pvp Stabilized Ag/Pd Nanoparticles and Its Potential As an Activator for Electroless Copper Deposition

Pd Nanoparticles As a New Activator for Electroless Copper Deposition

The Role of Poly(N-vinyl-2-pyrrollidone) in Ag∕Pd Nanoparticles Formation and Its Application to Electroless Deposition

Chemical preparation of Pd nanoparticles in room temperature ethylene glycol system and its application to electroless copper deposition

Research on Applying Direct Plating to Additive Process for Printed Circuit Board

Study on Chemical Activity of Electroless Copper Plating

Synthesis of Hydrophilic and Hydrophobic Pd Nanoparticles with in Situ Generated Reducing Agent and Their Application As Activator for Electroless Copper and Nickel Depositions

Study on a New Activation Method for Initiating Electroless Plating on Alumina Powders Based on SAMs Bonded Palladium

An accessible strategy for high-performance copper layer fabrication on polyphenylene oxide substrates via polydopamine functionalization and electroless deposition

Formation of Pd Catalyst by Nd:Yag Laser Irradiation for Electroless Copper Deposition

Copolymer of Pyrrole and 1,4-Butanediol Diglycidyl as an Efficient Additive Leveler for Through-Hole Copper Electroplating

Electrochemical and analytical study of electroplating additive in copper plating solution for microvia filling

Studies of polixetonium chloride as a novel, hypotoxic and single additive of copper electronic plating for microvia void-free filling in printed circuit board application

Electroless Copper Plating on PC Engineering Plastic with a Novel Palladium-Free Surface Activation Process

Competitive Adsorption Between Suppressor and Accelerator in Copper Methanesulfonic Acid Bath for Electrodeposition

Convection-Dependent Competitive Adsorption Between SPS and EO/PO on Copper Surface for Accelerating Trench Filling