Electrodeposition of Extremely Cu-Rich CuPd Bimetallic Nanoparticles from an Amide-Type Hydrophobic Protic Ionic Liquid

Chia-Lin Yu,Hsing-Yin Chen,Chien-Liang Lee,Po-Yu Chen
DOI: https://doi.org/10.1149/1945-7111/ad9994
IF: 3.9
2024-12-04
Journal of The Electrochemical Society
Abstract:Cupric oxide (CuO) and palladium(II) acetate (Pd(Ac)2) were dissolved into the amide-type hydrophobic protic ionic liquid (IL), protonated-betaine bis((trifluoromethyl)sulfonyl)amide ([Hbet][TFSA]), to produce the Cu(II) and Pd(II) species for the electrodeposition of metallic Cu, Pd, and CuPd nanoparticles (NPs). Unlike the electrodeposition conducted in common aqueous electrolytes containing the equivalent amounts of Cu and Pd ions, Cu-rich rather than Pd-rich CuPd co-deposits were obtained from the IL [Hbet][TFSA]; which might result from the retardation of Pd deposition on preferentially electrodeposited Cu surface or the formation of a new metal species when both metal ions co-existed in the IL, leading to an uncommon large overpotential needed to reduce the species into Pd metal. The surface morphologies of CuPd NPs significantly relied on their elemental compositions that could be controlled by the concentration of Pd(II) and/or the applied electrodeposition potential. CuPd NPs with different Pd contents showed very different responses in the reaction current of nitrate reduction. Nevertheless, the CuPd NPs regardless of the Pd contents showed advantages over the Cu nanoparticles in the electrochemical reduction of nitrate, which might be due to the synergistic effects between the Cu and Pd atoms.
electrochemistry,materials science, coatings & films
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