Application of reflection electron microscopy in cross-sectional study of multilayer semiconductor devices

l m peng,jie jiang,a y du,joe x zhou
DOI: https://doi.org/10.1116/1.586056
1992-01-01
Abstract:Reflection electron microscopy (REM) has been applied, for the first time, to study the cross-sectional structures of multilayer semiconductor devices. An example is given of a GaAs/AlxGa1-xAs multiple quantum wells infrared detector. The technique was used during the device fabrication process as an in-line monitoring method to provide a direct and precise dimensional measurement of a fabricated mesa so as to reach an optimum fabrication condition. The REM results are compared with those deduced from electrical measurements of the fabricated devices and a complete consistency is obtained.
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