Micro-Phase Saeparation in Epoxy Resin Waterborne Particles During Curing Process

XY Liu,D Qiu,ML Guo,ZZ Yang
DOI: https://doi.org/10.1142/s0256767905000771
2005-01-01
Chinese Journal of Polymer Science
Abstract:Sub-micron sized phenolic epoxy resin waterborne particles were prepared by phase inversion emulsification. Micro-phase separation occurred during the curing process at high temperature. The as-prepared samples possessed one glass transition temperature (T-g) and two exothermal processes during DSC heating scannings. After being thermally treated above the exothermal peak temperature, they possessed two glass transition temperatures with the disappearance of exothermal peaks, whilst a core/shell structure was formed. This was likely related with the outward diffusion of reactive oligomers to the outer layer of particles.
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