Stress analysis of polycrystalline thin films and surface regions by X-ray diffraction
J. Ligot,U. Welzel,P. Lamparter,A. C. Vermeulen,E. J. Mittemeijer
DOI: https://doi.org/10.1107/s0021889804029516
IF: 4.868
2005-01-19
Journal of Applied Crystallography
Abstract:The components of the macroscopic mechanical stress tensor of a stressed thin film, coating, multilayer or the region near the surface of a bulk material can in principle be determined by X-ray diffraction. The various analysis methods and measurement strategies, in dependence on specimen and measurement conditions, are summarized and evaluated in this paper. First, different X-ray diffraction geometries (conventional or grazing incidence) are described. Then, the case of macroscopically elastically isotropic, untextured specimens is considered: from the simplest case of a uniaxial state of stress to the most complicated case of a triaxial state of stress. The treatment is organized according to the number of unknowns to be determined ( i.e. the state of stress, principal axes known or unknown), the use of one or several values of the rotation angle φ and the tilt angle ψ of the sample, and one or multiple hkl reflections. Next, the focus is on macroscopically elastically anisotropic ( e.g. textured) specimens. In this case, the use of diffraction (X-ray) elastic constants is not possible. Instead, diffraction (X-ray) stress factors have to be used. On the basis of examples, it is demonstrated that successful diffraction stress analysis is only possible if an appropriate grain-interaction model is applied.
chemistry, multidisciplinary,crystallography