The Solution of Particle Improve for Silicon Oxidation

YANG Xumin,SHI Guoyong
DOI: https://doi.org/10.3969/j.issn.1681-1070.2013.01.008
2013-01-01
Abstract:In the semiconductor manufacturing,the particle will cause the leakage increase and break out the device at the oxidation silicon process in furnace,and its had been an mainly factor that affect the yield of product.This article is to investigate the problem of particle issue with the APCVD furnace by TEL Alpha8SE.For the testing data,analyze it and use the measurement equipment to find out the root cause,then to solve the problem of particle.Decrease the downtime and improve the utility of equipment,then the particle performance and the yield of product is improved,the process also has been optimized.
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