Development of Micro-scale Displacement and Profile Measurement Systemand its Applications

Hong MIAO,Tai-hua ZHANG,Yong HUAN,Xiao-ping WU
DOI: https://doi.org/10.3969/j.issn.1001-4888.2007.03.031
2007-01-01
Abstract:A micro-scale measurement system applicable to MENS components has been developed. The in-plane displacement, out-of-plane displacement and 3D profile of a loaded MEMS specimen can be measured in real-time with this system. White light digital speckle correlation method is employed in the system in combination with a loading device for in-plane displacement measurement. Phase shifting fringe projection technique is introduced to perform the out-of-plane displacement and 3D profile measurement. When combined with a micro loading device, the system can measure the out-of-plane displacement and the 3D profile of a loaded MEMS specimen in real-time. Finally, several representative experiment results obtained using the developed measurement system are presented.
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