Abstract:In this work, the interface chemistry and the reduction of GaAs surface species by using (NH4)(2)S solution prior to Gd-doped HfO2 (HGO) thin film deposition and the removal of Ga Oxides and elemental As by rapid thermal annealing (RTA) have been investigated by X-ray photoelectron spectroscopy (XPS). Additionally, the effect of the surface passivation and rapid thermal annealing on the electrical properties of MOS capacitors based on sputtering-derived HGO as gate dielectric on GaAs substrate has been detected by means of capacitance-voltage (C-V) and leakage current density-voltage (J-V) measurements. Based on electrical analysis, it can be noted that the constantly improvement of electrical properties, such as the decreases of flat band voltage (V-Fb), hysteresis (Delta Vib), oxide charge density (00,0, border trapped oxide charge density (N-bt) and leakage current density, have been observed. Especially, the dielectric constant of 16.72, flat band voltage yfb of 1.19 V, hysteresis Delta Vft, of 0.04 V, leakage current density of 1.54 x 10(-5) A/cm(2) at bias voltage of 1 V, total positive charge density and border trap charge density of 6.09 x 1012 CM-2 and 2.54 x 1011 cm(-2), respectively render 600 degrees C -annealed HGO thin films, potential high-k gate dielectrics in future CMOS devices. (C) 2017 Elsevier B.V. All rights reserved.

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