The diagnostic micromachined beams on (1 1 1) substrate

Hsin-Hwa Hu,Hung-Yi Lin,Weileun Fang,Bruce C.S. Chou
DOI: https://doi.org/10.1016/S0924-4247(01)00652-5
2001-01-01
Abstract:The undercut process of the micromachined structures on a (111) oriented silicon wafer is studied in this paper. As observed in the experiment, the undercut of a cantilever on (111) wafer is along the width of the beam. According to the undercut mechanism, the advantages of fabricating a cantilever on (111) wafer are three-fold: (1) significantly reduce the etching time and obtain an ideal clamped boundary in the mean time; (2) the thickness as well as the moment of inertia of the cantilever is closer to the ideal case; (3) the flexural rigidity of the cantilever is constant along the beam axis. Consequently, the micromachined cantilever on a (111) wafer is more appropriate in various applications. For instance, it is more appropriate to fabricate the diagnostic microstructures on the (111) wafer than on the (100) wafer in determining the thin film residual stress.
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