Abstract:Microelectromechanical systems (MEMS) technologies are developing rapidly with increasing study of the design, fabrication and commercialization of microscale systems and devices. Accurate knowledge on the mechanical behaviors of thin film materials used for MEMS is important for successful design and development of MEMS. Here a novel electroplating spring-bridge micro-tensile specimen integrates pin-pin align holes, misalignment compensate spring, load sensor beam and freestanding thin film is demonstrated and fabricated. The specimen is fit into a specially designed micro-mechanical apparatus to carry out a series of monotonic tensile testing on sub-micron freestanding thin films. Certain thin films applicable as structure or motion gears in MEMS were tested including sputtered gold, copper and tantalum nitride thin films. Metal specimens were fabricated by sputtering; for tantalum nitride film samples, nitrogen gas was introduced into the chamber during sputtering tantalum films on the silicon wafer. The sample fabrication method involves three steps of lithography and two steps of electroplating copper to hold a dog bone freestanding thin film. Using standard wet etching or lift off techniques, a series of microtensile specimens were patterned in metal thin films, holes, and seed layer for spring and frame structure on the underlying silicon oxide coated silicon substrate. Two steps of electroplating processing to distinct spring and frame portion of the test chip. Finally, chemical etched away the silicon oxide to separated electroplated specimen and silicon substrate.

Design Rule and Orientation Layout for MEMS Curved Beams on Silicon

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Mechanics of Curvilinear Electronics

Evaluation of Mechanical Properties and Strain Criterion for Realibility Design of Micromachined Polysilicon Thin Films

A C-shaped hinge for displacement magnification in MEMS rotational structures

Modeling and Structural Analysis of MEMS Shallow Arch Assuming Multimodal Initial Curvature Profiles

A Novel Method to Measure the Sidewall Angle of MEMS Structures

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Recent Efforts in Modelling Combined Rate, Size and Thermal Effects on Single Crystal Strength

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Modeling Large Deflections of Initially Curved Beams in Compliant Mechanisms Using Chained Beam Constraint Model

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Characterization of Residual Stress in SOI Wafers by Using MEMS Cantilever Beams

A Method of Measuring Young's Modulus and Residual Stress in Typical MEMS Structures Using a Surface Profilometer

Design analysis, modeling and simulation of novel rectangular cantilever beam for MEMS sensors and energy harvesting applications

A new in situ residual stress measurement method for a MEMS thin fixed-fixed beam structure

Mechanical characterization of biocompatible thin film materials by scanning along micro-machined cantilevers for micro-/nano-system

Post-CMOS Processing for High-Aspect-Ratio

Design of a micromechanical inclinometer with two strained silicon beams

Monotonic and fatigue testing of spring-bridged freestanding microbeams application for MEMS

Design And Fabrication Of A Slanted-Beam Mems Accelerometer