Abstract:Three-dimensional (3D) buckling assembly of flexible electronics from strategically designed two-dimensional (2D) precursor structures has enabled important applications in a variety of areas, owing to its versatile applicability to a broad range of length scales and high-performance materials, as well as to a rich diversity of 3D topologies. Rational design methods that allow direct mapping of 3D mesostructures onto unknown 2D precursor structures and loading parameters are foundational to these assembly technologies, but face scientific challenges, such as the high nonlinearity of spatial deformations and tricky bifurcation behaviors. While a few inverse design methods based on the beam theory, topology optimization and machine learning algorithms have been reported, the shape programming of freestanding 3D mesostructures/electronics with highly complex curvature distributions remains elusive. In this work, we propose a curvature programming method based on bilayer ribbon networks, along with a mold-assisted assembly strategy, as a new route to customizable freestanding 3D mesostructures and electronics. Combined mechanics modeling, finite element analyses and experimental measurements allow a clear understanding of nonlinear bending-stretching coupled deformations of bilayer ribbon networks during the 2D-to-3D transformation. A parameter domain with one-to-one mapping of the dimensionless curvature and the bending stiffness ratio is identified, offering a theoretical basis of the curvature programming. By introducing a discretization strategy, a variety of regular (e.g., circles, ellipses, spirals and toroids) and biomimetic 3D curved ribbons and mesosurfaces (e.g., mimicking wavy vines, diatoms and arbitrarily curled leaves) were inversely designed and experimentally realized. A device demonstration capable of strain/temperature sensing and micro-LEDs indication suggests application opportunities in bioelectronics and microelectromechanical systems.

Mechanics of Curvilinear Electronics

Dynamic Behaviors of Controllably Buckled Thin Films

Surface Effects on the Mechanical Behavior of Buckled Thin Film

A hierarchical computational model for stretchable interconnects with fractal-inspired designs

Mechanics of Noncoplanar Mesh Design for Stretchable Electronic Circuits

Lateral Buckling of Interconnects in A Noncoplanar Mesh Design for Stretchable Electronics

Postbuckling Analysis and Its Application to Stretchable Electronics

Stretchable, Curvilinear Electronics Based on Inorganic Materials

Curvature Programming of Freestanding 3D Mesostructures and Flexible Electronics Based on Bilayer Ribbon Networks

Fabrication Techniques for Curved Electronics on Arbitrary Surfaces

Theoretical Modeling of Conformal Criterion for Flexible Electronics Attached Onto Complex Surface

Optimized Structural Designs for Stretchable Silicon Integrated Circuits

Stretchable and Foldable Silicon Integrated Circuits

Finite Deformation Mechanics In Buckled Thin Films On Compliant Supports

Conformal Theoretical Modeling of Arbitrary Shape Flexible Electronic Sensors Mounted Onto General Curved Surface Substrates

Stretchability of Encapsulated Electronics

Complementary Metal Oxide Silicon Integrated Circuits Incorporating Monolithically Integrated Stretchable Wavy Interconnects

Experimental and Theoretical Analysis of Integrated Circuit (ic) Chips on Flexible Substrates Subjected to Bending

Controlled Buckling of Thin Films on Compliant Substrates for Stretchable Electronics

Assembly of complex 3D structures and electronics on curved surfaces

Designing Thin, Ultrastretchable Electronics with Stacked Circuits and Elastomeric Encapsulation Materials.