Fabrication and Analysis of Micromachined Cantilever Array

于晓梅,张大成,李婷,王小宝,阮勇,杜先锋
DOI: https://doi.org/10.3969/j.issn.1674-4926.2003.08.017
2003-01-01
Abstract:Six groups of piezoresistive cantilever with different sizes were designed on a chip. The stress of rectangular cantilever was simulated with a common FEA simulator ANSYS. The noise, signal, and minimum detectable deflection (MDD) of piezoresistive cantilever were studied. Based on the silicon micromachining technology, the piezoresistive cantilever was fabricated with polysilicon as piezoresistive material. With the measurement results of noise and sensitivity, the MDD of piezoresistive cantilever was calculated to be 1 nm at 6 V bias voltage and 1000 Hz measurement bandwidth.
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