Abstract:Flexible integrated photonics is an essential technology for emerging applications, including flexible optical interconnects, optogenetic stimulation, and implantable conformal sensing. Here, a novel and universal route for fabricating flexible photonic components with high-refractive-index contrast is reported. Central to such a unique method is the utilization of germanium oxide (GeO) as the sacrificial layer for releasing nanostructures from rigid substrates to flexible substrates. Various high-quality inorganic optical materials can be grown directly on GeO by different thin-film deposition methods due to its resistance to both high temperature and high-power oxygen plasmas. In addition to the absence of restrictions on the material choices and integration processes for flexible photonic structures, the approach uses water as the etchant to remove the sacrificial layer, which has minimal impact on the optical performance of the photonic structures. Using this approach, a strain-insensitive/sensitive microring resonator based on plasma-enhanced chemical vapor deposited silicon nitride and reactive sputtered titanium oxide, respectively, is demonstrated, establishing the strategy as a facile and universal route for the fabrication of high-index-contrast flexible integrated photonic devices with various functionalities.

Phase Gratings Made with Inductively Coupled Plasma Technology

Reactive ion beam etching for diffractive optical elements

Isotropic Etch for SiO2 Microcantilever Release with ICP System

Etching Quartz with Inductively Coupled Plasma Etching Equipment

Design and Fabrication of Infrared Hybrid Refractive/diffractive Optical System for 3-5Μm Band

Deep groove etching for partial reflectors in InP-based monolithically integrated photonic devices

Surface Grating Fabrication by Inductively Coupled Plasma Dry Etching for InP-Based Photonic Integrated Circuits

Deep InP gratings for opto-electronic devices etched by Cl 2/CH 4/Ar inductively coupled plasma

Large-Scale High-Accuracy and High-Efficiency Phase Plate Machining

Study on ICP Dry Etching Technology for Nanostructure Photonic Device Fabrication

NOVEL ETCHING TECHNOLOGY OF INP BY INDUCTIVELY COUPLED PLASMA1

A Universal Approach to High-Index-Contrast Flexible Integrated Photonics

Deep InP Gratings for Opto-Electronic Devices Etched by Cl <sub>2</sub> /CH <sub>4</sub> /Ar Inductively Coupled Plasma

Room Temperature Dry Etching of INP-Based Semiconductors for Optoelectronic Device Fabrication Using Inductively Coupled Plasma

Vertical and Smooth, Etching of Inp by Cl-2/Ch4/Ar Inductively Coupled Plasma at Room Temperature

A process study of electron beam nano-lithography and deep etching with an ICP system

High-Efficiency Fabrication of Geometric Phase Elements by Femtosecond-Laser Direct Writing

Demonstration of High-Performance, Sub-Micron Chalcogenide Glass Photonic Devices by Thermal Nanoimprint

ICP vs CCP in High Aspect Ratio Etching of SiO2 using Ar/C4F8/O2 Gas Mixtures

The study and optimization of ICP deep etching at a low-temperature for InP solid-immersion metalens fabrication