Abstract:In this paper, we studied a novel packaging scenario that aims to integrate or eliminate the existing multilevel packaging hierarchies toward single level integration. This new approach is an extension of VLSI technology where standard IC processes were pursued in the whole fabrication sequence. Main benefits include very high performance, ultra high density, mixed-signal integration, and inexpensive. Several key technologies such as chip assembly and planarization were developed. A feasible fabrication procedure for single level integration has been established. Demonstrating modules were presented. Interconnect structures, signal and power distribution, and electrical performance were studied theoretically and experimentally for GHz off-chip operating. Properties of signal propagation and coupling from chip to chip were investigated both in frequency domain and in time domain by simulations and by high frequency measurements. The studies show that the new modules are capable of several Gb/s/pin data rate for off-chip communications. Besides, some design guidelines for best performance are obtained through the work.

Transient And Crosstalk Analysis Of Interconnection Lines For Single Level Integrated Packaging Modules

Methods and designs for improving the signal integrity for 3D electrical interconnects in high performance IC packaging

Single Level Integrated Packaging Modules For High Performance Electronic Systems

Modeling and Characterization of On‐Chip Interconnects

Electro-Thermo-Mechanical Investigation On Multi-Level Interconnects In The Presence Of An Esd Pulse

Signal Transmission Analysis of Multilayer Graphene Nano-Ribbon (MLGNR) Interconnects

Signal Integrity Analysis of Graphene Nano-Ribbon (GNR) Interconnects

Transfer Functions of On-Chip Global Interconnects Based on Distributed RLCG Interconnects Model

Transient Electrothermal Analysis of Interconnects in the Presence of a ESD pulse

Crosstalk Prediction of Single- and Double-Walled Carbon-Nanotube (SWCNT/DWCNT) Bundle Interconnects

Investigations on Delay Interconnect Lines for High-Speed Designs with the Numerical Technique

Progress and Research on Interconnects Crosstalk in Deep Submicron Technology

Progress and Research on Interconnects Crosstalk in Deep Submicron Technology1

A Shielding Structure for Crosstalk Reduction in Silicon Interposer

Single Level Integration Packaging: Meeting the Requirements of Ultra High Density and High Frequency

Low-loss Through Silicon Vias (tsvs) and Transmission Lines for 3D Optoelectronic Integration

Scaling analysis of interconnectivity and crosstalk in VLSI circuits

Different designs of TSVs for 3D IC: Signal integrity analysis with cascaded scattering matrix

Modeling and Measurement of A Novel Shielding Design in Silicon Interposer

Crosstalk Reduction in TSV Arrays with Direct Ohmic Contact Between Metal and Silicon-Substrate

Crosstalk Immune Interconnect Driver Design