Abstract:Future inter- and intra-ULSI interconnect systems demand extremely high data rates (up to 100 Gbps/pin or 20-Tbps aggregate) as well as bidirectional multiI/O concurrent service, re-configurable computing/processing architecture, and total compatibility with mainstream silicon system-on-chip and system-in-package technologies. In this paper, we review recent advances in interconnect schemes that promise to meet all of the above system requirements. Unlike traditional wired interconnects based solely on time-division multiple access for data transmission, these new interconnect schemes facilitate the use of additional multiple access techniques including code-division multiple access and frequency-division multiple access to greatly increase bandwidth and channel concurrency as well as to reduce channel latency. The physical transmission line is no longer limited to a direct-coupled metal wire. Rather, it can be accomplished via either wired or wireless mediums through capacitor couplers that reduce the baseband noise and dc power consumption while simplifying the fabrication process by eliminating vertical metal studs needed in three-dimensional ICs. These new advances in interconnect schemes would fundamentally alter the paradigm of ULSI data communications and enable the design of next-generation computing/processing systems.

Crosstalk Immune Interconnect Driver Design

Progress and Research on Interconnects Crosstalk in Deep Submicron Technology

Advanced RF/baseband Interconnect Schemes for Inter- and Intra-Ulsi Communications

A Shielding Structure for Crosstalk Reduction in Silicon Interposer

Three-dimensional circuit integration based on self-synchronized RF-interconnect using capacitive coupling

Progress and Research on Interconnects Crosstalk in Deep Submicron Technology1

Methods and designs for improving the signal integrity for 3D electrical interconnects in high performance IC packaging

Two 10Gb/s/pin Low-Power Interconnect Methods for 3D ICs

Crosstalk Reduction in TSV Arrays with Direct Ohmic Contact Between Metal and Silicon-Substrate

THz Interconnect for Inter-/Intra-chip Communication

Modeling and Measurement of A Novel Shielding Design in Silicon Interposer

A Coupling and Crosstalk Considered Timing-Driven Global Routing Algorithm for High Performance Circuit Design

Signal Propagation Effects on High‐speed Interconnection Lines Using Time‐domain Numerical Technique

Signal Integrity Simulation and Analysis in High-Speed Interconnects by Using FDTD

A Novel Low-Crosstalk Driveline Based On Spoof Surface Plasmon Polaritons

Crosstalk analysis in frequency and time domain using FDTD-VF method

Switching sensitive driver circuit to combat dynamic delay in on-chip buses

Crosstalk and Congestion Driven Layer Assignment Algorithm

Fast time domain crosstalk analysis of through silicon vias based on equivalent circuit model

Worst case crosstalk noise effect analysis in DSM circuits by ABCD modeling

High Speed Parallel Signal Crosstalk Cancellation Concept