Abstract:Structural hybridization and size miniaturization of integrated photonic devices are among the hotspots of photonics research field. The crosstalk between densely arranged subwavelength-width optical waveguides such as optical microfibers has become an important issue. Here we investigate a common case of crosstalk in two intersecting subwavelength-diameter optical microfibers at 1550-nm wavelength by numerical simulations and experiments, and obtain the dependence of coupling efficiency and crosstalk on modal polarizations, intersection angle, fiber diameter and separation of the two fibers, respectively. The simulation results show that, the crosstalk decreases with increasing intersection angle and separation between the two microfibers. Especially, for single-mode microfibers, the crosstalk is lower than 1% (i. e., better than -20 dB) when the intersection angle is larger than 60 similar to, and can be minimized to less than 0.05% (i. e., better than -33 dB) for perpendicular intersection (i. e., intersection angle of 90 degrees). However, the dependence of crosstalk on fiber diameter is not monotonous, typically, from the single-mode cutoff diameter, the crosstalk increases with decreasing diameter until reaching a maximum, and decreasing afterward. To verify the simulation, we have experimentally measured the angle-dependent crosstalk between contacting microfibers with typical diameters. With increasing intersection angle, the crosstalk drastically decreases to a negligible value (less than -41 dB for vertically intersecting microfibers), which is consistent with the simulation results. Our results offer a valuable reference or guideline for designing compact optical interconnection and integration with optical microfibers or other subwavelength-width waveguides alike.

Progress and Research on Interconnects Crosstalk in Deep Submicron Technology1

Progress and Research on Interconnects Crosstalk in Deep Submicron Technology

Crosstalk in Two Intersecting Optical Microfibers

A Wideband Model for On-Chip Interconnects with Different Shielding Structures

Modeling and Characterization of On‐Chip Interconnects

Crosstalk Prediction of Single- and Double-Walled Carbon-Nanotube (SWCNT/DWCNT) Bundle Interconnects

Electromagnetic-Thermal Characterization Of On On-Chip Coupled (A)Symmetrical Interconnects

An Equivalent Circuit Model with Current Return Path Effects for On-Chip Interconnect Up to 80 Ghz

Transfer Functions of On-Chip Global Interconnects Based on Distributed RLCG Interconnects Model

A Shielding Structure for Crosstalk Reduction in Silicon Interposer

Modeling and Measurement of A Novel Shielding Design in Silicon Interposer

Experimental Characterization of Coupling Effects Between Two On-Chip Neighboring Square Inductors

Experimental Characterization of On-Chip Inductor and Capacitor Interconnect: Part I. Series Case

Carbon‐Based Interconnects for RF Nanoelectronics

A simple approach to modeling substrate coupling in mixed-signal integrated circuits by TCAD

Noise Margin Constraints for Interconnectivity in Deep Submicron Low Power and Mixed-Signal VLSI Circuits

Crosstalk Immune Interconnect Driver Design

Shielding Area Optimization under the Solution of Interconnect Crosstalk

Layer Assignment Algorithm For Rlc Crosstalk Minimization

Crosstalk Reduction in TSV Arrays with Direct Ohmic Contact Between Metal and Silicon-Substrate

Analysis of Electromagnetic Interaction Between Smooth and Corrugated Transmission Lines by Using a Circuit Model