The Formation of SiCN Film on Si Substrate by Constant-Source Diffusion
X. L. He,X. Z. Chai,L. Yu,P. Han,S. Fan,L. Huang,T. Tao,Z. Y. Li,Z. L. Xie,X. Q. Xiu,P. Chen,B. Liu,X. M. Hua,H. Zhao,R. Zhang,Y. D. Zheng
DOI: https://doi.org/10.1016/j.tsf.2017.09.034
IF: 2.1
2017-01-01
Thin Solid Films
Abstract:The SiCN film, which has the same crystal structure as 3C-SiC verified by X-ray diffraction and Raman scattering, has been formed on Si (111) substrate by constant-source diffusion using a chemical vapor deposition system. Via X-ray photoelectron spectroscopy, the film has been identified as the mixture of elemental Si and SiC1−xNx alloy, with the SiC1−xNx content decreases from 87.4% to 17.9% and the mole fraction x increases from 0.17 to 0.21, as the depth extends from the near surface to the interface. The measured composition distribution can be well explained by the constant-source diffusion model, confirms that the formation mechanism of the SiCN film is the diffusion of C and N into the Si substrate. This provides a new method for fabricating crystalline SiCN thin films.