Effects of Silicon Incorporation on Composition, Structure and Electric Conductivity of Cubic Boron Nitride Thin Films

J. Ying,X. W. Zhang,Y. M. Fan,H. R. Tan,Z. G. Yin
DOI: https://doi.org/10.1016/j.diamond.2010.08.004
IF: 3.806
2010-01-01
Diamond and Related Materials
Abstract:We have achieved in-situ Si incorporation into cubic boron nitride (c-BN) thin films during ion beam assisted deposition. The effects of silicon incorporation on the composition, structure and electric conductivity of c-BN thin films were investigated by Fourier transform infrared spectroscopy, X-ray photoelectron spectroscopy and electrical measurements. The results suggest that the content of the cubic phase remains stable on the whole with the incorporation of Si up to a concentration of 3.3at.%, and the higher Si concentrations lead to a gradual change from c-BN to hexagonal boron nitride. It is found that the introduced Si atoms only replace B atoms and combine with N atoms to form Si–N bonds, and no evidence of the existence of Si–B bonds is observed. The resistance of the Si-doped c-BN films gradually decreases with increasing Si concentration, and the resistivity of the c-BN film with 3.3at.% Si is lowered by two orders of magnitude as compared to undoped samples.
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