Stress Impedance Effect of FeCoSiB/Cu/FeCoSiB Sandwich Layers on Flexible Substrate

B. Peng,W. L. Zhang,J. D. Liu,W. X. Zhang
DOI: https://doi.org/10.1016/j.jmmm.2011.01.021
IF: 3.097
2011-01-01
Journal of Magnetism and Magnetic Materials
Abstract:FeCoSiB/Cu/FeCoSiB sandwich layers were deposited on flexible substrate to develop flexible stress/strain sensors. The influence of stress on the impedance of the multilayers is reported. The results show that the variation of the impedance increases with the increase in deflection of the free end of the cantilever. A relative change in impedance of 6.4% is obtained in the FeCoSiB(1.5μm)/Cu(0.25μm)/FeCoSiB(1.5μm) sandwich layers at 1MHz with deflection of 2mm. The stress impedance effects are sensitive to the frequency of the current and the thickness of both FeCoSiB and Cu layers. The stress impedance effect increases with the increase in the thickness of FeCoSiB or Cu layers. The stress impedance effect increases slightly with the increase in frequency and decreases with the further increase in frequency, which can be understood by the stress and frequency-dependent permeability of magnetic films.
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