Stress-impedance Effects in Sandwiched FeCuNbCrSiB/Cu/FeCuNbCrSiB Films

Ji-An Chen,Wen Ding,Yong Zhou,Ying Cao,Zhi-Min Zhou,Ya-Min Zhang

DOI: https://doi.org/10.1016/j.matlet.2006.03.065

IF: 3

2006-01-01

Materials Letters

Abstract:Sandwiched FeCuNbCrSiB/Cu/FeCuNbCrSiB films with a meander structure have been realized on silicon cantilever by Microelectromechanical Systems (MEMS), and the stress-impedance (SI) effects have been studied in the frequency range of 1-40 MHz. Experimental results show that the values of SI ratio increase with the deflection, and a large SI ratio of -24.5% at 5 MHz with the deflection of 2 mm is obtained in the sandwiched FeCuNbCrSiB/Cu/FeCuNbCrSiB films, and the strain gauge factor is 1255 at 5 MHz, and is larger than the conventional metal strain gauge and semiconductor strain gauge, which is attractive for the applications of strain sensors. (c) 2006 Elsevier B.V. All rights reserved.