Microradiography and the glycosaminoglycans in myositis ossificans.

K. Solheim

1968-03-01

Abstract:

What problem does this paper attempt to address?

Electrochemical Analysis of Cathode in TSV Copper Electroplating

Haiyong Cao,Xue Feng,Qi Sun,Wei Luo,Huiqin Ling,Jiangyan Sun,Ming Li

DOI: https://doi.org/10.1109/icsj.2012.6523399

2012-01-01

Abstract:In TSV copper electroplating, the most important is to form the “bottom up” deposition. In order to achieve this kind of super-filling, additive in the electroplating bath need to play its own role at the respective position. Accelerator adsorb at the bottom of the via to accelerate the deposition of copper while suppressor mostly adsorb at the top of the via to inhibit the deposition. Therefore, vias could be supper-filled without any void. In this paper, bis(3-sulfopropyl) disulfide (SPS) and polyethylene glycol (PEG) were used as accelerator and suppressor respectively. The supper-filling mechanism and the competitive adsorption of SPS and PEG were being researched by means of linear sweep voltammetry (LSV) and cyclic voltammogram (CV). The electrochemical analysis and the experimental plating are closely related.
Trace Bis-(3-sulfopropyl)-disulfide Enhanced Electrodeposited Copper Foils

Lingling Liu,Yeqiang Bu,Yue Sun,Jianfeng Pan,Jiabin Liu,Jien Ma,Lin Qiu,Youtong Fang

DOI: https://doi.org/10.1016/j.jmst.2020.10.019

2021-01-01

Abstract:Smooth and strong copper foils are highly required for the development of printed circuit boards and Li-ion batteries. Adding additives is an efficient and low-cost method to enhance electrodeposited copper foils. Here we chose Bis-(3-sulfopropyl)-disulfide (SPS) as the additive and investigated its concentration on the surface roughness and tensile strength of the electrodeposited copper foils. A copper foil with the smoothest surface (Rz = 2.1 mu m) and the highest tensile strength (similar to 338 MPa) was prepared with 1.5 mg/L SPS. The contact angle on the copper foil decreased with the reduction of surface roughness. The enhancing mechanism of the SPS was investigated by scanning electron microscopy and X-ray diffraction. The refined grain and enhanced (220) texture were considered to be the radical reason for the smooth and strong copper foils. The electrochemical results prove the suppressing effect is related to the SPS adsorption. (C) 2021 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology.
Improving thermal stability and Hall-Petch breakdown relationship in nanocrystalline Cu: A molecular dynamics simulation study

Snehanshu Pal,K. Vijay Reddy,Chuang Deng

DOI: https://doi.org/10.1016/j.matlet.2022.132821

IF: 3

2022-07-13

Materials Letters

Abstract:Nanocrystalline metals suffer from grain growth and breakdown of the Hall-Petch-type strengthening below 20 nm due to a shift in the fundamental deformation mechanisms. Here, we designed a novel columnar nanocrystalline Cu specimen with solely coincidence site lattice (i.e., CSL Ʃ3 and Ʃ9) grain boundaries that simultaneously exhibits exceptional thermal stability and mitigates the Hall-Petch breakdown using molecular dynamics simulations. Moreover, the CSL GBs enabled continuous enhancement in strength with decreasing grain size in this specimen thus mitigating the Hall-Petch breakdown phenomenon. We believe that this study can aid in the design of ultra-strong and stable nanocrystalline metals with advanced mechanical and structural properties.

materials science, multidisciplinary,physics, applied
Effects of initial Cu grain size and impurity residues on the liquid phase reactions between molten solder and electroplated Cu

Li-Chi Huang,Jenn-Ming Song,Chih-Ming Chen

DOI: https://doi.org/10.1016/j.matchar.2023.113459

IF: 4.537

2023-12-01

Materials Characterization

Abstract:Copper (Cu) electroplating is a cost-effective and scalable technology used to fabricate interconnects/metallizations in microelectronic products. Liquid-phase soldering reactions between electroplated Cu and Sn-based alloys are essential for constructing heterogeneous joints for mechanical support and electrical conduction applications. In this study, three Cu electroplated layers with different grain sizes and impurity contents are fabricated by formulating additives in the plating solution. The Cu electroplated layers are reacted with molten Sn-3.5 wt% Ag alloy at 260 °C for 20–60 min to investigate the liquid phase reactions. Microstructural characterizations of the electroplated Cu layers and the Cu/solder/Cu joints are carried out using electron microscopy and X-ray diffraction processes. A time-of-flight secondary ion mass spectrometer is used to analyze the impurity contents in the Cu electroplated layers. The Cu/solder/Cu joints after liquid phase reactions are mechanically analyzed to measure the shear strength. The results show that the additive formulas affect the microstructural features and the impurity contents in the Cu electroplated layers. Electroplating of Cu with an ultrafine grain texture accompanies a high impurity content, and the solder joint constructed by the ultrafine-grained Cu exhibits a rapid liquid phase reaction and interfacial voiding propensity, leading to a low shear strength.

materials science, multidisciplinary,metallurgy & metallurgical engineering, characterization & testing
1216 Nano-Scale Strength Analysis by EBSD and AFM Hybrid Method in Ultrafine-Grained Copper Processed by ECAP

Yuka KOJIMA,Hidehiko KIMURA,Yoshiaki AKINIWA,Yang JU

DOI: https://doi.org/10.1299/jsmemecjo.2008.6.0_277

2008-01-01

Abstract:Ultrafine-grained Cu processed by ECAP (Equal Channel Angular Pressing) with the grain size of d = 300 nm was fatigued at low stress intensity factor to investigate the grain coarsening mechanism during fatigue. EBSD (Electron Backscatter Diffraction) and AFM (Atomic Force Microscopy) methods were employed for the nanometer-scale analysis. The results show that fatigue damage area around the crack is observed in coarsened grains. Slip damages with the primary and secondary slip system were activated during fatigue. The detailed observation before and after fatigue at the same region revealed that the grain boundary of the coarsened grain moves as a high angle boundary. The initial residual strain in ECAP-processed Cu is considered to be one of the driving factors of the high angle boundary.
Influence of impurities on the sintering densification in nano- Al2O3 powders coated by copper

Yuan-ting Liu,Guo-ping Ling

DOI: https://doi.org/10.3969/j.issn.1005-0299.2005.05.022

2005-01-01

Abstract:Eletroless copper plating on nano-Al2O3 is using for fabricating copper-Al2O3 compounds which are subsequently sintered by the method of conventional powder metallurgy. It has been found that nano-Al2O3 powders coated by copper have abnormal sintering characteristic and are hard to be compacted. The results obtained from the researching of cleaning, thermogravimetric analysis (TG), SEM and EDS of powders and their sintering sample shown that impurities were adsorbed on the surface of nano-Al2O3 powders coated by copper. While powders are reduced and sintered at a high temperature, thermal decomposition of impurities will take place, which deposits carbon on the surface of copper and influences on the sintering course of powders.
Mechanical Properties and Microstructure of Rolled and Electrodeposited Thin Copper Foil

Xiang-Qian Yin,Li-Jun Peng,Saif Kayani,Lei Cheng,Jian-Wei Wang,Wei Xiao,Li-Gen Wang,Guo-Jie Huang

DOI: https://doi.org/10.1007/s12598-016-0806-4

2016-01-01

Abstract:Commercial grade rolled and electrodeposited copper foils from Japan and China were selected, and their mechanical properties and microstructure were investigated. It was observed that there are notable differences in fracture strength, elongation at break and hydrophilicity between rolled and electrodeposited copper foils. The rolled copper foils have higher tensile strength, lower ductility and larger static contact angle than electrodeposited copper foils. The rolled copper foils contain a β-fiber texture, and the electrodeposited copper foils have random crystalline orientations. It was also observed that the rolled foils have packed grains, and electrodeposited foils have equiaxial grains. The uniform fine grain size and a few substructures of Japanese electrodeposited foils are major reasons for their higher elongation.
Preparation, micro-structure and characterization of high strength and low profile lithium copper foil with SPS and HP additives

Juan Liao,Lijuan Wang,Ning Song,Jian Huang,Man Zhao,Meng Zhao,Yunzhi Tang,Yuhui Tan,Xiaowei Fan

DOI: https://doi.org/10.1016/j.mseb.2023.116969

2023-10-26

Materials Science & Engineering B: Solid-State Materials for Advanced Technology

Abstract:Copper foil is an important negative current collector material for lithium ion battery. Its mechanical properties and appropriate roughness have an important influence on the negative electrode and battery performance. Adding additives to the plating solution is an effective means to improve the performance of lithium copper foil. Here we prepared Cu-(SPS + HP) copper foil with a tensile strength of 570.57 MPa, elongation of 4.47%, and roughness of 0.812 μm. Moreover, the optical contact angle test shows that Cu-(SPS + HP) has the best surface wettability (the highest surface energy 50.62 mN/m). XRD and EBSD tests show that the fundamental reason for improving the mechanical properties of Cu-(SPS + HP) is the preferred orientation of the crystal plane (2 2 0) and the phenomenon of large grains including small grains. Besides, the electrochemical test of Cu-(SPS + HP) bath is conducted to determine the principle of additives in the plating process, cathodic reaction characteristics and electrocrystallization nucleation mechanism. Finally, we establish the electrodeposition model. The reaction behavior of SPS and HP in the plating process synergistically promoted the preparation of excellent performance lithium copper foil.

English Else
Effect of additives on the microstructure and properties of pulsed electrodeposited copper foils

Jingpei Liu,Wanchang Sun,Zhongbo Bai,Eryong Liu,Hui Cai,Shasha Tian,Congxiao Zhang,Yifan Xu,Bo Zhang,Mengran Zhou,Tianze Jia

DOI: https://doi.org/10.1080/00202967.2024.2413276

2024-10-30

Transactions of the IMF

Abstract:A low-roughness ultra-thin copper foil was prepared by pulsed electrodeposition with a duty cycle 60%, pulse frequency of 600 Hz on titanium. The influence of sodium 3,3'-dithiodipropane sulphonate (SPS), hydroxyethyl cellulose (HEC), gelatin and collagen additives on the microstructure, mechanical properties and electrochemical behaviour of electrolytic copper foil was explored. Furthermore, the reaction mechanism of SPS and collagen additives on electrodeposited copper were discussed. The results showed that at 0.08 g L −1 collagen concentration, the lowest thickness, the highest microhardness and the optimal surface roughness were achieved (5.12 μm, 279.63 HV and 1.885 μm, respectively). X-ray diffraction results confirmed that electrolytic copper foils prepared when SPS was introduced into the blank solution had a preferred orientation of (220) texture, which benefitted from the synergistic effect of copper ions and additives. The intermediates formed by the additive and Cu + occupied the active sites on the cathode surface that increased the nucleation sites for deposition. In addition, the formed complexes can act as a barrier to narrow ion deposition channels and inhibit the growth of Cu ions.

electrochemistry,metallurgy & metallurgical engineering,materials science, coatings & films
Microstructure evolution in Cu-2.13Fe-0.026P (wt%): The contribution of texture intensity to residual stress variation

Tian Wang,Lifang Hu,Yuhui Guo,Shaohua Wang,Aidong Lan,Junwei Qiao

DOI: https://doi.org/10.1016/j.jallcom.2024.176509

IF: 6.2

2024-09-22

Journal of Alloys and Compounds

Abstract:The leadframe is a crucial part that is frequently employed in electronic equipment, and the stability and dependability of the device are directly impacted by its performance. In this work, the microstructural evolution of Cu-2.13Fe-0.026P alloy and the relationship between the texture intensity and residual stress under different annealing time are investigated by scanning electron microscopy (SEM), backscattering diffractometer (EBSD), and nanoindentation instrument, and the corrosion behavior of the alloy in HCl and CuCl 2 solution systems was summarized. It was found that regulating the texture intensity of the alloys could significantly influence the residual stresses. The residual stress is not monotonically decreasing with time, and the alloys have the lowest residual stress when annealed for 10 min. In addition, the experiments pointed out that the microstructure is essential for the etching performance of copper alloys. The role of low-Σcoincidence site lattice (ΣCSL) grain boundaries in the connectivity of the random high-angle grain boundaries (RHAGB) network leads to better etching performance of the 10-minute annealed alloys than the 30-minute alloys, providing new perspectives on optimizing the microstructure of thin strips of etched copper alloys.

materials science, multidisciplinary,chemistry, physical,metallurgy & metallurgical engineering
Impurity effect on recrystallization and grain growth in severe plastically deformed copper

Yao Jiang,Rui Cong Gu,Martin Peterlechner,Yu Wei Liu,Jing Tao Wang,Gerhard Wilde

DOI: https://doi.org/10.1016/j.msea.2021.141786

2021-09-01

Abstract:The impurity effect on commercial purity copper (4N and 3N) was investigated by comparing their annealing induced recrystallization and grain growth behavior after severe plastic deformation. Equal channel angular pressing (ECAP) with additional cryogenic rolling was applied to produce equiaxed ultra-fine grained (UFG) and nano-laminated (NL) coppers with high stored excess energy. The stored excess energy increased with decreasing purity from 4N to 3N, whereas the grain boundary velocity and recrystallized grain size decreased for both UFG and NL Cu. In particular, the NL structures were found to be more sensitive to impurities than equiaxed ultra-fine grained ones, and consequently the abnormal grain growth at the early stages of recrystallization in NL 4N Cu was effectively suppressed in NL 3N Cu. The analysis of the grain growth rate during recrystallization, using the microstructural path methodology (MPM), demonstrates that the correlation between the abnormal grain growth and the significantly enhanced grain boundary mobility cannot be solely explained by the high stored excess energy. Under all conditions, the impurity drag effect poses a kinetic constraint on the rate-controlling mechanism for grain boundary migration.

materials science, multidisciplinary,nanoscience & nanotechnology,metallurgy & metallurgical engineering
Microstructure and Mechanical Strength of Near- and Sub-Micrometre Grain Size Copper Prepared by Spark Plasma Sintering

K. N. Zhu,A. Godfrey,N. Hansen,X. D. Zhang

DOI: https://doi.org/10.1016/j.matdes.2016.12.042

IF: 9.417

2016-01-01

Materials & Design

Abstract:Spark plasma sintering (SPS) has been used to prepare fully dense samples of copper in a fully recrystallized condition with grain sizes in the near- and sub-micrometre regime. Two synthesis routes have been investigated to achieve grain size control: (i) SPS at different temperatures from 800 to 1000°C, and (ii) SPS at 800°C followed by annealing at temperatures from 950 to 1050°C. By use of an initial spherical powder with an average particle diameter of ≈0.5μm, samples with average grain sizes in the range from 0.5 to 3μm have been prepared. Microstructural examination based on both transmission electron microscope, and on electron back-scatter diffraction studies, confirms the samples are in a nearly fully recrystallized condition, with grains that are dislocation-free, and have a random texture, with a high fraction of high angle boundaries. The mechanical strength of the samples has been probed using hardness measurements and tensile testing, revealing an enhanced strength for samples with grain sizes less than ≈1μm.
A Study of Electroplated Nanoporous Copper Using Aberration-Corrected Transmission Electron Microscopy

Jianqiang Wang,Jintao Wang,Ziwen Lv,Luobin Zhang,Fengyi Wang,Hongtao Chen,Mingyu Li

DOI: https://doi.org/10.3390/nano14060487

IF: 5.3

2024-03-08

Nanomaterials

Abstract:Nanoporous Cu foam is widely applied in many fields such as the packaging of electronic power devices. In this study, a sandwich-structured Cu-Zn eutectic alloy precursor composed of Cu0.53Zn0.47/Cu5Zn8/Cu0.53Zn0.47 is prepared through electroplating. The surface layer of the precursor, Cu0.53Zn0.47, has a flat surface with numerous grain boundaries, which effectively promotes its dealloying behavior. By contrast, Cu5Zn8 has a porous structure, which promotes the dealloying behavior at the center of the precursor. The dealloying of Cu0.53Zn0.47 is dominated by the coherent surface diffusion of Cu atoms, and the crystal lattice and orientation show no changes before and after dealloying. By contrast, the dealloying behavior of Cu5Zn8 requires the renucleation of Cu crystals; in this process, Cu atoms are transported to the surface of the layer by capillary forces to form clusters, which nucleate and grow.

materials science, multidisciplinary,physics, applied,nanoscience & nanotechnology,chemistry
Properties and Microstructure Regulation of Electrodeposited Ultra-thin Copper Foil in a Simple Additive System

Haiyang Chen,Kaibin Chen,Yinying Sheng,Jiahui Qu,Xiaojian Wang,Deqiang You,Dayong Shan

DOI: https://doi.org/10.1088/2053-1591/ad4e9e

IF: 2.025

2024-05-22

Materials Research Express

Abstract:Hydroxyethyl cellulose (HEC) has been commonly used in a variety of complex formulations for acid copper plating. However, the roles of HEC acting in acid copper plating still lacks of systematic investigation. To explore the efficacy of HEC in the deposition of the ultra-thin electrodeposited copper foil (ED-Cu), we designed a simple formulation system, in which HEC was used as the single organic additive. Using electron backscatter diffraction (EBSD), microstructures of the prepared ED-Cu was comprehensively investigated. The results showed that the ED-Cu was characterized by a mixed distribution of columnar and equiaxed crystals. Grain morphology, dislocation density and crystal orientation of the ED-Cu could be regulated by HEC concentration. According to the cyclic voltammetry (CV) and chronoamperometry (CA) results, the introduction of HEC between 0-200 ppm led to a polarizing effect, which marginally increased with the HEC concentration. Meanwhile, the increase of HEC concentration enhanced the nucleation rates of copper and reduced the grain size during instantaneous nucleation. The introduction of the HEC also altered the preferred orientation of the ED-Cu foil. Mechanical results showed that the optimum concentration of HEC addition was 125 mg/L.

materials science, multidisciplinary
Effect of impurities on anisotropic grain growth in (111)-oriented nanotwinned copper

Minghui Zhang,Li-Yin Gao,Qi Zhang,Dawei Wang,Wei Dong,Ning Zhao,Zhi-Quan Liu

DOI: https://doi.org/10.1016/j.matchar.2024.114056

IF: 4.537

2024-06-04

Materials Characterization

Abstract:The (111) oriented copper with a nanotwin structure, known as (111) nt-Cu, demonstrates exceptional physical properties and enhanced anti-corrosion, rendering it suitable for application as the interconnection material in integrated circuit (IC) technology. Nevertheless, the microstructure of (111) nt-Cu may intermittently diminish following annealing processes exceeding 200 °C due to the occurrence of anisotropic grain growth. This investigation delves into the determinants influencing the thermal stability of (111) nt-Cu films. The (111) nt-Cu films were continuously electroplated employing identical electrolyte. Despite the consistent depletion of the additives, the microstructure of (111) nt-Cu basically remained unchanged. Nevertheless, the thermal stability of (111) nt-Cu films with a similar microstructure decreased with the depletion of additives. Time-of-flight secondary ion mass spectroscopy (TOF-SIMS) was employed to quantify the integration of non-metallic impurities (such as N, O, C, S and Cl) within the electrodeposited (111) nt-Cu, induced by the electrolyte additive chemistry. According to the SIMS analysis, a notable disparity in impurity intensity between two (111) nt-Cu films electroplated using the electrolyte for different durations was observed, primarily attributed to the presence of chlorine. Chlorine formed robust chemical bonds with Cu atoms, thereby immobilizing boundaries and impeding the anisotropic grain growth process. This study endeavors to introduce a novel perspective on enhancing the thermal stability of (111) nt-Cu through engineered chemical additives.

materials science, multidisciplinary,metallurgy & metallurgical engineering, characterization & testing
Trace sulfur-induced embrittlement of ultrahigh-purity copper

Yunxiao Hua,Haitao Liu,Kexing Song,Jiangwei Wang,Yanjun Zhou,Tao Huang,Shaolin Li,Xiaowen Peng,Qianqian Zhu

DOI: https://doi.org/10.1016/j.msea.2022.143397

2022-07-19

Abstract:Sulfur (S), as an impurity element in copper and copper-based alloys, usually leads to intergranular embrittlement even at ppm concentrations. However, the intrinsic mechanisms of the embrittlement remain largely unclear. In this study, we systematically investigate the influence of trace amounts of S (53 and 300 wt ppm) on the ductility of an ultrahigh-purity copper (99.99999%) in the range of room temperature to 900 °C. Tensile results show an excellent plastic deformation capacity at any test temperature for the ultrahigh-purity copper, while a remarkable reduction in ductility for both S-containing alloys, particularly at 300–750 °C. A microanalysis reveals formation of micro- and nanoscale Cu–S precipitates, mainly distributed at grain boundaries, acting as the nucleation sites for small cavities leading to the crack initiation. This is responsible for the ductility loss in the S-containing alloys in the whole temperature range. The distinct embrittlement behavior between 300 and 750 °C is independent on the crystallographic orientation relationship between the Cu–S precipitates and Cu matrix, but is dominated by the temperature-dependent phase transition behavior of the Cu–S precipitates. Such a structural transformation with the volume expansion accelerates the nucleation and propagation of the microcracks, causing the intergranular embrittlement at intermediate temperatures. Our findings provide a comprehensive experimental understanding on the fundamental mechanisms of impurity-induced the embrittlement in metallic materials.
Influence of macroscale dimension on the electrocrystallization of Cu pad and redistributed layer in advanced packaging

Jin‐Hao Liu,Yong‐Qiang Wan,Li‐Yin Gao,Xian‐Wei Cui,Zhi‐Quan Liu,Jin-Hao Liu,Yong-Qiang Wan,Li-Yin Gao,Xian-Wei Cui,Zhi-Quan Liu

DOI: https://doi.org/10.1002/adem.202400304

IF: 3.6

2024-03-31

Advanced Engineering Materials

Abstract:Equiaxed copper (EG Cu), copper with columnar nanotwinned grains (C‐NT Cu), and copper with mixed equiaxed and columnar grains (MG Cu) were electroplated on pads and redistributed layers (RDLs) with different dimensions. When the diameters of pads increased from 40 μm to 105 μm, the flatness of pads decreased from 34.5% to 24.0%. And the flatness gradually deteriorated from 16.5 % to 34.4 % with the increase of RDL width from 8 μm to 20 μm. In contrast, the flatness of C‐NT Cu and MG Cu fluctuated between 1 % and 5 %, showing a weak correlation on the dimension. In terms of microstructure, the EG Cu and MG Cu had a weak correlation with size change, and the grain orientation showed a randomness. However, the (111) texture component of C‐NT Cu differed greatly with different dimensions, especially in transition layer. The (111) texture component changed from 9.6% to 38.1% for φ 40‐105 μm pad, and from 14.3% to 18.9% for 8‐20 μm wide RDL. The study reveals the significant size effect on the deposited profile and microstructure of electrodeposited copper materials, which should give insights of the materials design in advanced packaging technology. This article is protected by copyright. All rights reserved.

materials science, multidisciplinary
Effects of Fe(III) and Cu(I) on Electrodeposition and Microstructure Characterization for Acid Plating Bath

Jing Xiang,Yingjie Wang,Chong Zeng,Yonggang Xu,Wenyao Yang,LiangLiang Tian,Haibo Ruan,Qiang Yang

DOI: https://doi.org/10.1007/s12678-022-00743-5

2022-06-30

Electrocatalysis

Abstract:Electrodeposited copper is a very critical technology for 3D interconnection structure to ensure the stability of signal transmission in IC package substrate. However, Cu(I) produces during long-term electrodeposition and has an obvious adverse effect on the surface microstructure and brightness of electrodeposited copper. In this paper, Fe(III) was introduced into the electrodeposited copper system to solve the negative effect of Cu(I) on the electrodeposited copper layer and improve the surface performance of copper layer. The galvanostatic measurement (GM), cyclic voltammetry (CV), electrochemical impedance spectroscopy (EIS), and polarization curves were used to explore the effect of Cu(I) and Fe(III) on the electrochemical behaviors of the electrolyte system. Simultaneously, the surface microscopic characterization and brightness of the copper layers were observed by scanning electron microscope (SEM), camera, diffraction of x-rays (XRD), and 3D confocal laser microscope (3D-CLM). Finally, the results showed that Fe(III) improved the surface microstructure, recovered brightness of copper layer, and restored the ratio of the copper crystal planes (200) and (220).

chemistry, physical,electrochemistry
Effects of Normal Stress, Surface Roughness, and Initial Grain Size on the Microstructure of Copper Subjected to Platen Friction Sliding Deformation

Shan-quan Deng,Andrew-William Godfrey,Wei Liu,Cheng-lu Zhang,Ben Xu

DOI: https://doi.org/10.1007/s12613-016-1211-6

2016-01-01

International Journal of Minerals Metallurgy and Materials

Abstract:The effects of applied normal stress, surface roughness, and initial grain size on the microstructure of pure Cu developed during platen friction sliding deformation (PFSD) processing were investigated. In each case, the deformation microstructure was characterized and the hardness of the treated surface layer was measured to evaluate its strength. The results indicated that the thickness of the deformed layer and the hardness at any depth increased with increasing normal stress. A smaller steel platen surface roughness resulted in less microstructural refinement, whereas the microstructural refinement was enhanced by decreasing the surface roughness of the Cu sample. In the case of a very large initial grain size (d > 10 mm), a sharper transition from fine-grain microstructure to undeformed material was obtained in the treated surface layer after PFSD processing.
Processing and Specimen Thickness to Grain Size (t/d) Ratio Effects on Tensile Behaviour and Microformability of Copper Foils

Javed S. Ibrahim,Rohit T. Mathew,M. J. N. V. Prasad,K. Narasimhan

DOI: https://doi.org/10.1007/s12540-021-01145-w

IF: 3.451

2022-04-11

Metals and Materials International

Abstract:Owing to high heat flux ability and good mechanical strength, copper has been used for micro-electro-mechanical systems (MEMS) components with dimensions in micrometers processed by electrochemical methods. In the present study, fine grained copper foils of different thicknesses and grain sizes produced by pulsed electrodeposition under different controlled current densities were used to investigate the effect of total number of grains across thickness of foil on its tensile response and formability. For a comparative study, commercially available rolled Cu foils were also used. Vacuum annealing was employed to obtain a wide range of fully recrystallized grain sizes within same thickness of the foils. Detailed microstructural characterization was carried out using scanning electron microscope attached with electron backscattered diffraction detector. The foils were subjected to uniaxial tensile testing and formability testing using a miniaturized Nakazima test setup. As anticipated, finer the grain size higher was the yield strength. However, the strength of copper reduced with decreasing the total number of grains across thickness of the foil. The electrodeposited Cu foil exhibited relatively higher strength levels but reduced tensile ductility along with decreased strain hardening ability compared to the fully recrystallized Cu foils having similar grain sizes. Furthermore, the number of grains across thickness and the prior history of foils played significant role on the shape and trend in variation of the forming limit curve of Cu. An α-fiber (< 110 >) texture evolved in Cu during deformation and its volume fraction strengthened under biaxial deformation conditions.Graphical

materials science, multidisciplinary,metallurgy & metallurgical engineering

Microradiography and the glycosaminoglycans in myositis ossificans.

Electrochemical Analysis of Cathode in TSV Copper Electroplating

Trace Bis-(3-sulfopropyl)-disulfide Enhanced Electrodeposited Copper Foils

Improving thermal stability and Hall-Petch breakdown relationship in nanocrystalline Cu: A molecular dynamics simulation study

Effects of initial Cu grain size and impurity residues on the liquid phase reactions between molten solder and electroplated Cu

1216 Nano-Scale Strength Analysis by EBSD and AFM Hybrid Method in Ultrafine-Grained Copper Processed by ECAP

Influence of impurities on the sintering densification in nano- Al2O3 powders coated by copper

Mechanical Properties and Microstructure of Rolled and Electrodeposited Thin Copper Foil

Preparation, micro-structure and characterization of high strength and low profile lithium copper foil with SPS and HP additives

Effect of additives on the microstructure and properties of pulsed electrodeposited copper foils

Microstructure evolution in Cu-2.13Fe-0.026P (wt%): The contribution of texture intensity to residual stress variation

Impurity effect on recrystallization and grain growth in severe plastically deformed copper

Microstructure and Mechanical Strength of Near- and Sub-Micrometre Grain Size Copper Prepared by Spark Plasma Sintering

A Study of Electroplated Nanoporous Copper Using Aberration-Corrected Transmission Electron Microscopy

Properties and Microstructure Regulation of Electrodeposited Ultra-thin Copper Foil in a Simple Additive System

Effect of impurities on anisotropic grain growth in (111)-oriented nanotwinned copper

Trace sulfur-induced embrittlement of ultrahigh-purity copper

Influence of macroscale dimension on the electrocrystallization of Cu pad and redistributed layer in advanced packaging

Effects of Fe(III) and Cu(I) on Electrodeposition and Microstructure Characterization for Acid Plating Bath

Effects of Normal Stress, Surface Roughness, and Initial Grain Size on the Microstructure of Copper Subjected to Platen Friction Sliding Deformation

Processing and Specimen Thickness to Grain Size (t/d) Ratio Effects on Tensile Behaviour and Microformability of Copper Foils