High Drain Current Density E-Mode ${\rm Al}_{2}{\rm O}_{3}$/AlGaN/GaN MOS-HEMT on Si With Enhanced Power Device Figure-of-Merit $(4\times 10^{8}~{\rm V}^{2}\Omega^{-1}{\rm cm}^{-2})$

T. Egawa,T. Kubo,J. Freedsman
DOI: https://doi.org/10.1109/TED.2013.2276437
IF: 3.1
2013-08-16
IEEE Transactions on Electron Devices
Abstract:In this paper, we report on the enhancement-mode (E-mode) Al<sub>2</sub>O<sub>3</sub>/AlGaN/GaN metal-oxide-semiconductor high-electron mobility transistors (MOS-HEMTs) on Si. The E-mode operation is due to the negative charges in the atomic layer deposited Al<sub>2</sub>O<sub>3</sub> layer. The unrecessed E-mode MOS-HEMTs exhibit high drain current density with a low specific ON-state resistance (R<sub>ON</sub>,<sub>sp</sub>) of 0.7 mΩ·cm<sup>2</sup>. A low gate leakage current showed enhancements in the subthreshold characteristics such as ION/IOFF ratio ~10<sup>8</sup> and subthreshold slope of 75 mV/decade. This E-mode device showed good retention characteristics of threshold voltage upto 10<sup>5</sup> s. Furthermore, the E-mode MOS-HEMT exhibits an OFF-state breakdown voltage of 532 V for short gate-to-drain distance (L<sub>gd</sub>=4 μm) that records a high power device figure of merit (FOM=BV<sup>2</sup>/R<sub>ON,sp</sub>) value of 4×10<sup>8</sup> V<sup>2</sup>Ω<sup>-1</sup>cm<sup>-2</sup>.
Materials Science,Engineering,Physics
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