Insights into thin film blistering of gold coating on metal substrate
Jing Cao,Bo Yuan,Na Gong,Tzee Luai Meng,Siew Lang Teo,Anna Marie Yong,Xikui Zhang,Ming Lin,Rahul Karyappa,Lei Zhang,Chee Kiang Ivan Tan,Ady Suwardi,Qiang Zhu,Hongmei Jin,Christopher M. Harvey,Simon Wang,Hongfei Liu
DOI: https://doi.org/10.1016/j.apsusc.2022.155700
IF: 6.7
2022-11-19
Applied Surface Science
Abstract:Au thin films, up to h ≈ 90 nm thick, have been deposited by direct current sputtering at room temperature to address the effect of coating thickness on film blistering that occurred on Ni-based single crystal (NBSC) superalloy rather than on Si. Transmission electron microscopy provides evidence that the blisters nucleated at the Au/NBSC interface. Statistically, the diameters of the blisters increases while their density decreases with the increase in h ; however, the height-to-diameter ratios of the blisters measured from the film surface are rather constant and independent of h . When h is increased from ≤63 nm to ∼90 nm, the size distribution of the blisters turns from a single mode to a bimodal along with an emergence of larger circular blisters and edge-like ones. Mechanical modelling and density-function calculations provide evidence that the formation of blisters is driven by pockets of energy concentration while the nucleation site is influenced by surface absorbents of the substrate.
chemistry, physical,physics, applied, condensed matter,materials science, coatings & films