Effect of holding time on the microstructure and strength of tungsten/steel joints by HIP diffusion bonded using a Cu interlayer

Jiajia Zhang,Donghua Xie,Qishou Li,Chunli Jiang,Qiang Li

DOI: https://doi.org/10.1016/j.matlet.2019.126875

IF: 3

2020-02-01

Materials Letters

Abstract:The microstructure and mechanical properties of W and steel joints with a Cu interlayer, bonded by hot isostatic pressing (HIP) diffusion under 1050 °C for 0.5–2 h with 150 MPa, were investigated. The results show that a reliable bonding between W and steel could be obtained by HIP using Cu interlayer. Metallographic analysis revealed excellent bonding at all of the joining interfaces through elements inter-diffusion across the W/Cu, Cu/steel interface. Neither intermetallic compounds nor other brittle phases occurred in the bonded region. The diffusion layer thickness across the W/Cu, Cu/steel interface and tensile strength increased with increasing holding time. The tensile strength of the joints was as high as 480 MPa. The surface fracture analyses revealed a plastic fracture occurred in the middle of Cu interlayer far apart from diffusion zone. The hardness distribution across the joining interfaces demonstrated W/Cu, Cu/steel interfaces could be enhanced by solid solution hardening. Soft Cu interlayer could effectively reduce residual stress and improve the mechanical properties through solid solution strengthening of diffusion zone at interface.

materials science, multidisciplinary,physics, applied