Abstract:In this study, tungsten and steel were successfully bonded utilizing hot isostatic pressing diffusion bonding with a Ni-Si-B interlayer. The interfacial structures and formation mechanisms of joints with interlayers of various thicknesses were systematically investigated. The results indicated that the interfacial structure of a joint with a thin (0.8 μm) Ni-Si-B interlayer is a W/Fe-W inter-metallic compound (IMC) reaction layer/(Fe,Ni)ss diffusion layer/steel structure, where through cracks appear at the interface of the W/reaction layer, leading to poor shear strength. As the interlayer thickness increases (3.2 to 22.9 μm), the brittle Fe-W IMC no longer appears and the interfacial structure is a W/Ni-W IMCs reaction layer/(Ni,Fe)ss diffusion layer/steel structure. When the interlayer thickness is 3.2 μm, there are many large voids in the diffusion layer. When the interlayer thickness increases to 5.3 μm, the most compact interfacial structure can be obtained with the maximum bonding strength of 363.5 MPa. However, when the interlayer thickness increases further to 12.6 and 22.9 μm, many voids appear in the reaction layer, leading to a decrease in bonding strength. The formation mechanism of a joint with a thin (0.8 μm) interlayer is a purely solid-solid reaction without the generation of a liquid phase. When the interlayer thickness is large (3.2 to 22.9 μm), the formation process of joints includes three stages: solid-solid reaction, remaining interlayer liquefaction, and solid-liquid reaction. Electron probe microanalysis results reveal that the melting-point depressant element Si is segregated in the reaction layer or diffusion layer depending on the interlayer thickness, which is precisely controlled by the staged formation mechanism of the joints.

Effect of joining temperature on the microstructure and strength of tungsten/ferritic steel joints diffusion bonded with a nickel interlayer

Effect of holding time on the microstructure and strength of tungsten/ferritic steel joints diffusion bonded with a nickel interlayer

Microstructure and mechanical properties of diffusion bonded joints between tungsten and F82H steel using a titanium interlayer

Characterization of Ductile Nano-Tic Dispersed V4Cr4Ti/RAFMs Solid Diffusion Joint for Nuclear Fusion Reactor Application

Microstructure and strength of diffusion bonded 304 stainless steel/tungsten joints using different interlayers

Investigation of tungsten/steel diffusion bonding with Ni–Fe cladding on tungsten substrate

On the use of CoCrFeNi high entropy alloy as a new interlayer for achieving high strength diffusion bonded tungsten/steel joint

Effect of holding time on the microstructure and strength of tungsten/steel joints by HIP diffusion bonded using a Cu interlayer

Interface Behaviors and Mechanical Properties of Diffusion Bonded 45 Steel/additive Manufactured 316L Steel Joints

Tungsten/steel diffusion bonding using Cu/W–Ni/Ni multi-interlayer

Interfacial structure and formation mechanism of tungsten/steel HIP diffusion bonding joints using Ni interlayer

Microstructural evolution and mechanical properties in the partial transient liquid phase diffusion bonding of tungsten to steel

Microstructure, properties, and formation mechanisms of tungsten/steel hot isostatic pressing diffusion bonding joint utilizing a Ni-Si-B interlayer

Microstructure, residual stresses and mechanical properties of diffusion bonded tungsten–steel joint using a V/Cu composite barrier interlayer

Effect of Ni interlayer on diffusion bonding of a W alloy and a Ta alloy

Diffusion bonding of copper alloy to nickel-based superalloy: effect of heat treatment on the microstructure and mechanical properties of the joints

Effect of Bonding Temperature on Microstructure and Mechanical Properties of 304L/Zircaloy‐4 Diffusion‐Bonded Joints with Ni/Ta Hybrid Interlayer

Interfacial microstructure and mechanical properties of tungsten alloy/steel diffusion bonding joint using CrFeCoNiCu high entropy alloy interlayer

Interfacial reaction and microstructure investigation of 4J36/Ni/Cu/V/TC4 diffusion-bonded joints

A novel high entropy composite interlayer for diffusion bonding of TC4 titanium alloy to 316 L stainless steel

Effect of bonding process on the microstructures and strength of W/steel joints with a W-Cu-Ni interlayer