Effect of Ni interlayer on diffusion bonding of a W alloy and a Ta alloy

Jian Zhang,Ruxia Liu,Qinqin Wei,Guoqiang Luo,Qiang Shen,Lianmeng Zhang
DOI: https://doi.org/10.3139/120.111066
IF: 2.528
2017-09-01
Materials Testing
Abstract:The combination of W and Ta is expected to be highly beneficial for many applications from aerospace, weapons, military and nuclear industry. In this paper, W and Ta alloys were successfully diffusion bonded with Ni interlayer. The process of the formation of W/Ni/Ta diffusion bonded joints was investigated by means of scanning electron microscopy, X-ray diffraction system, electron probe micro-analyzer, energy dispersive spectrometry and shear strength measurement. The results show that the shear strength increases when the bonding temperature increases and exhibits a maximum value of 244 MPa at 930 °C. The bonding of W/Ni can be attributed to the bonding of Ni to tungsten grains and the bonding of Ni to a Ni-Fe-binder mainly by elemental diffusion. The fracture takes place in the Ni/Ta interface and Ni3Ta and Ni2Ta intermetallic compounds are formed on the fracture surfaces.
materials science, characterization & testing
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