Interfacial reaction and microstructure investigation of 4J36/Ni/Cu/V/TC4 diffusion-bonded joints
Qi Gao,Xiaosong Jiang,Hongliang Sun,Tingfeng Song,Defeng Mo,Xue Li
DOI: https://doi.org/10.1016/j.matlet.2021.130809
IF: 3
2021-12-01
Materials Letters
Abstract:Diffusion bonding of 4J36 invar alloy and TC4 titanium alloy was carried out by inserting Ni/Cu/V multi-layer metal interlayer. The results showed that temperature had a significant effect on microstructure and mechanical properties of welded joints. At 890 °C, the joint tensile strength reached maximum value of 249.3 MPa. Fe-Ni solid solution ((Fe,Ni)ss), Cu-Ni solid solution ((Cu,Ni)ss), V-Cu solid solution ((V,Cu)ss) and Ti-V solid solution ((Ti,V)ss) were produced at interfaces of 4J36/Ni, Ni/Cu, Cu/V and V/TC4, respectively, and fracture surfaces of all joints showed dimples of different sizes, which showed that the application of Ni/Cu/V interlayer was an effective method.
materials science, multidisciplinary,physics, applied