Research on Be/CuCrZr Bonding by Hot Isostatic Pressing at Intermediate Temperature

Jia-mei TAN,Peng-cheng ZHANG,Ji-ming CHEN,Shang-qi ZHOU

DOI: https://doi.org/10.3969/j.issn.0258-0926.2007.z1.016

2007-01-01

Abstract:The interface characteristics of Be/CuCrZr joints gained by HIP diffusion bonding used Ti/Cu as interlayer at 580°C, 140 MPa and different holding time is studied by scanning electron microscopy (SEM), Energy Dispersive Spectrum (EDS) and X-Ray Diffraction (XRD). The result indicates that Ti can prevent the diffusion between Be and Cu, which tends to diffuse to Cu rather than to Be, and unsymmetrical diffusion occurs. Both of two samples ruptured at the diffusion area near the Cu-alloy side. For both of Be side fracture, there are a mass of α-Be, some BeO and Ti, and much Cu distributes in the CuCrZr side fracture. For the sample with longer holding time, intermetallic compounds and Ti also exist in the fracture. In contrast, little intermetallic compounds exist for shorter sample holding time. The texture exists in Cu coating and is anisotropic, which badly affects the bonding strength of joints.