Interface characterization of Be/CuCrZr joints by hot isostatic pressing bonding

Xisheng Wang,Pengcheng Zhang,Xiaobin Xian,Jiming Chen,Liang Shen,Qingfu Wang,Huogen Huang
DOI: https://doi.org/10.3321/j.issn:1002-185x.2008.12.021
2008-01-01
Rare Metal Materials and Engineering
Abstract:Joining of Be/CuCrZr by HIP technique with and without various interlayers were selected as screening test for optimum method and conditions. Metallurgical observation and shearing tests were performed for basic characterization of the bonded joints. Among the joints examined, the joints HIP-bonded at 580 degrees C, 140 MPa, 2 h without interlayer and with Ti (PVD-coated on Be)/Cu (PVD-coated on CuCrZr) interlayer were all showed relatively high strength at RT. The factors such as material combinations, RIP conditions all have influence on diffusion bonding of beryllium and CuCrZr alloy. At the HIP temperature of 580 degrees C, Ti coating on the beryllium surface can prevent the formation of brittle intermetallic phase between beryllium and copper. By the Be/CuCrZr HIP process of 580 degrees C for 2 h, the hardness of CuCrZr recovered up to 77% of that of the as-received.
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