Study on Microstructure and Mechanical Properties of Ti/Cu/Stainless Steel Joint by Impulse Pressure Diffusion Bonding

Jing WANG,Yong WANG
DOI: https://doi.org/10.14158/j.cnki.1001-3814.2016.19.016
2016-01-01
Abstract:To improve the performance of diffusion bonded Ti/stainless steel joint,shorten the bonding time,and control interfacial reaction product overgrowth,50 μm copper foil was used as interlayer between Ti and stainless steel to carry out impulse pressure diffusion bonding.Then,the interfacial microstructure and the mechanical properties of impulse pressure diffusion bonded Ti/Cu/stainless steel joint were investigated by using scanning electron microscopy (SEM),tensile tests and XRD analysis.Results reveal that reliable joint can be obtained when bonded for only 120 s.Intermetallic compound layers including Ti2Cu,TiCu,Ti3Cu4 and TiCu4 are generated at the Ti/Cu interface,whereas Fe-Cu solid solution is generated at the Cu/stainless steel interface.Under tensile loading,the joint firactures along the Ti/Cu interfacial reaction layer in a brittle mode,and the maximum tensile strength of 340 MPa is achieved.
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