Abstract:In this study, tungsten and steel were successfully bonded utilizing hot isostatic pressing diffusion bonding with a Ni-Si-B interlayer. The interfacial structures and formation mechanisms of joints with interlayers of various thicknesses were systematically investigated. The results indicated that the interfacial structure of a joint with a thin (0.8 μm) Ni-Si-B interlayer is a W/Fe-W inter-metallic compound (IMC) reaction layer/(Fe,Ni)ss diffusion layer/steel structure, where through cracks appear at the interface of the W/reaction layer, leading to poor shear strength. As the interlayer thickness increases (3.2 to 22.9 μm), the brittle Fe-W IMC no longer appears and the interfacial structure is a W/Ni-W IMCs reaction layer/(Ni,Fe)ss diffusion layer/steel structure. When the interlayer thickness is 3.2 μm, there are many large voids in the diffusion layer. When the interlayer thickness increases to 5.3 μm, the most compact interfacial structure can be obtained with the maximum bonding strength of 363.5 MPa. However, when the interlayer thickness increases further to 12.6 and 22.9 μm, many voids appear in the reaction layer, leading to a decrease in bonding strength. The formation mechanism of a joint with a thin (0.8 μm) interlayer is a purely solid-solid reaction without the generation of a liquid phase. When the interlayer thickness is large (3.2 to 22.9 μm), the formation process of joints includes three stages: solid-solid reaction, remaining interlayer liquefaction, and solid-liquid reaction. Electron probe microanalysis results reveal that the melting-point depressant element Si is segregated in the reaction layer or diffusion layer depending on the interlayer thickness, which is precisely controlled by the staged formation mechanism of the joints.

Investigation of tungsten/MA956 steel diffusion bonding with an Nb/Ni composite interlayer

Microstructure and Mechanical Properties of Diffusion Bonded W/MA956 Steel Joints with a Titanium Interlayer by SPS

Tungsten/steel diffusion bonding using Cu/W–Ni/Ni multi-interlayer

Investigation of tungsten/steel diffusion bonding with Ni–Fe cladding on tungsten substrate

Interfacial structure and formation mechanism of tungsten/steel HIP diffusion bonding joints using Ni interlayer

Microstructure, residual stresses and mechanical properties of diffusion bonded tungsten–steel joint using a V/Cu composite barrier interlayer

Microstructure, properties, and formation mechanisms of tungsten/steel hot isostatic pressing diffusion bonding joint utilizing a Ni-Si-B interlayer

Interface Behaviors and Mechanical Properties of Diffusion Bonded 45 Steel/additive Manufactured 316L Steel Joints

Microstructure Evolution and Mechanical Properties of W/MA956 Joints by Brazing

Interfacial microstructure and strengthening mechanism of W/steel diffusion bonding joint using a porous NiFeWss interlayer prepared by in-situ reduction

Interfacial microstructure and mechanical properties of tungsten alloy/steel diffusion bonding joint using CrFeCoNiCu high entropy alloy interlayer

Investigation of tungsten/EUROFER97 diffusion bonding using Nb interlayer

Effect of Ni interlayer on diffusion bonding of a W alloy and a Ta alloy

Microstructural evolution and mechanical properties in the partial transient liquid phase diffusion bonding of tungsten to steel

Effect of bonding process on the microstructures and strength of W/steel joints with a W-Cu-Ni interlayer

Effect of holding time on the microstructure and strength of tungsten/ferritic steel joints diffusion bonded with a nickel interlayer

Interfacial Microstructure Investigation Of Diffusion Bonded New Ni-Cr-W Superalloy Using Cu Interlayer

On the use of CoCrFeNi high entropy alloy as a new interlayer for achieving high strength diffusion bonded tungsten/steel joint

Characterization of Diffusion Bonded W/Steel Joint by Electroplating-Assisted Hot Isostatic Pressing

Interfacial microstructures, residual stress and mechanical analysis of hot isostatic pressing diffusion bonded joint of 93W–4.9Ni–2.1Fe alloy and 30CrMnSiNi2A steel

Investigation on W/Fe Diffusion Bonding Using Ti Foil and Ti Powder Interlayer by Sps