A multi-level capacitor-less memory cell fabricated on a nano-scale strained silicon-on-insulator

Jea-Gun Park,Seong-Je Kim,Mi-Hee Shin,Seung-Hyun Song,Sung-Woong Chung,Hirofumi Enomoto,Tae-Hun Shim
DOI: https://doi.org/10.1088/0957-4484/22/31/315201
IF: 3.5
2011-08-05
Nanotechnology
Abstract:A multi-level capacitor-less memory cell was fabricated with a fully depleted n-metal-oxide-semiconductor field-effect transistor on a nano-scale strained silicon channel on insulator (FD sSOI n-MOSFET). The 0.73% biaxial tensile strain in the silicon channel of the FD sSOI n-MOSFET enhanced the effective electron mobility to ∼ 1.7 times that with an unstrained silicon channel. This thereby enables both front- and back-gate cell operations, demonstrating eight-level volatile memory-cell operation with a 1 ms retention time and 12 µA memory margin. This is a step toward achieving a terabit volatile memory cell.
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