CMOS Logic and Capacitorless DRAM by Stacked Oxide Semiconductor and Poly-Si Transistors for Monolithic 3-D Integration
Ziheng Wang,Liankai Zheng,Zhiyu Lin,Jinxiu Zhao,Wei Tang,Linrun Feng,Zhe Liu,Xuefei Li,Xiaojun Guo,Mengwei Si
DOI: https://doi.org/10.1109/ted.2024.3418768
IF: 3.1
2024-07-26
IEEE Transactions on Electron Devices
Abstract:In this work, we demonstrate capacitorless dynamic random access memory (DRAM) and complementary metal-oxide–semiconductor (CMOS) logic circuits by vertically stacked ZnO transistors and low-temperature polycrystalline silicon (LTPS) transistors on the same chip. High-performance ZnO transistors are achieved by atomic layer deposition, exhibiting a field-effect mobility ( of 35.2 cm2/V s, subthreshold slope (SS) down to 71 mV/dec, and low off-state current (I A/ m. Such ZnO transistors are used as write transistors in the capacitorless two transistor (2T0C) DRAM cell and as n-FETs in the CMOS logic gates, achieving long retention time with memory window (MW) (I /I after s in DRAM (at a storage capacitance of 130 fF) and high inverter voltage gain of 181 V/V at VDD of 4.5 V in CMOS logic. Besides, a novel 2T0C DRAM with LTPS p-FET as read transistors is demonstrated, showing enhanced storage node voltage (V enabled by coupling capacitance, providing a promising approach to improve retention and reduce operating voltage for 2T0C DRAM.
engineering, electrical & electronic,physics, applied