Kr-Plasma Process for Conductance Control of MFSFET With FeND-HfO2 Gate Insulator

S. Ohmi,M. Tanuma,J.W. Shin
DOI: https://doi.org/10.1109/jeds.2024.3462930
2024-10-01
IEEE Journal of the Electron Devices Society
Abstract:In this work, we have investigated the conductance control of the metal-ferroelectrics-Si field-effect transistor (MFSFET) utilizing 5 nm thick ferroelectric nondoped (FeND-HfO2) gate insulator. The Kr-plasma process is effective to decrease the plasma damage compared to the Ar-plasma process during the in-situ deposition of FeND-HfO2 and Pt gate electrode by RF-magnetron sputtering. The precise control such as less than 20 mV was realized which led to the conductance control for 10 states from 0 to S/ m both for potentiation and depression operations with the input pulses of V/100 ns.
engineering, electrical & electronic
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