Abstract:Silica nanoparticles are widely utilized abrasives in chemical mechanical polishing (CMP), and the modification of abrasives and the incorporation of chemical additives represent primary strategies for enhancing CMP performance. In this study, we achieved a modification of the electrical properties of the colloidal silica surface by forming a coating film through the "grafting" of 3-aminopropyltriethoxysilane (APTES) onto the colloidal silica surface. This modification resulted in an augmented mechanical interaction between the abrasive and the wafer during the CMP process, leading to an enhanced material removal rate (MRR) of SiO 2 . However, the post-CMP surface exhibited a relatively higher occurrence of surface defects. Subsequently, cetyltrimethylammonium bromide (CTAB) was added as an auxiliary additive, which promoted the formation of a "special electrostatic self-assembly structure" on the surface of the abrasive, further elevating the SiO 2 MRR. Moreover, CTAB demonstrated the capability to adsorb onto the wafer surface, creating a protective effect that resulted in reduced surface roughness and a decrease in surface defects following CMP. Furthermore, comprehensive characterization of the modified abrasive was conducted using techniques such as transmission electron microscopy (TEM) and scanning electron microscopy (SEM). The mechanisms underlying the improvement in CMP performance were systematically analyzed through experimental phenomena and X-ray photoelectron spectroscopy (XPS), and revealing that the introduction of CTAB indirectly facilitated the adsorption of APTES onto the surface of the colloidal silica. Our study provides a method for the advanced process of SiO 2 CMP with stringent metal ion requirements.

Preparation of alumina/silica core-shell abrasives and their CMP behavior

Preparation of Porous Alumina Abrasives with Different Morphologies and their Chemical Mechanical Polishing Behavior

Preparation of Composite Spherical Alumina Nanoparticles and Study on their CMP Performance

Preparation of copper-incorporated mesoporous alumina abrasive and its CMP behavior on hard disk substrate

Preparation of porous alumina abrasives and their chemical mechanical polishing behavior

Preparation of α-alumina/polymethacrylic acid composite abrasive and its CMP performance on glass substrate

Chemical mechanical polishing of hard disk substrate with α-alumina-g-polystyrene sulfonic acid composite abrasive

Preparation of porous alumina/ceria composite abrasive and its chemical mechanical polishing behavior

CMP of hard disk substrate using a colloidal SiO2 slurry: preliminary experimental investigation

Polymer coated γ-aminopropyltriethoxysilane-modified α-alumina non-spherical nanocomposite abrasives and their chemical mechanical polishing behavior on glass-ceramic substrate

Non-spherical abrasives with ordered mesoporous structures for chemical mechanical polishing

Chemical Mechanical Polishing of Aluminum Alloys using Alumina-Based Slurry

A special electrostatic self-assembly structure of colloidal silica: Improving Chemical Mechanical Polishing performance

Preparation of Ordered Mesoporous Si02/Mc N anocomposite Abrasives and Their Chemical Polishing Behavior on Fused Silicon Substrates

Application of surface analysis in study on removal mechanism and abrasive selection during fused silica chemical mechanical polishing

High-performance chemical mechanical polishing slurry for aluminum alloy using hybrid abrasives of zirconium phosphate and alumina

Development of core–shell SiO 2 @A-TiO 2 abrasives and novel photocatalytic chemical machinal polishing for atomic surface of fused silica

Preparation of Silane Modified Sio2 Abrasive Particles and Their Chemical Mechanical Polishing (cmp) Performances

Preparation and Mechanical Properties of Core-Shell PS&CeO2 Composite Abrasive Particles

A novel atomic removal model for chemical mechanical polishing using developed mesoporous shell/core abrasives based on molecular dynamics

Trivalent lanthanum and ytterbium doped meso-silica/ceria abrasive systems toward chemical mechanical polishing (CMP) and ultraviolet irradiation-assisted photochemical mechanical polishing (PCMP)