Selenium implantation in GaAs

K. Gamo,T. Inada,S. Krekeler,J.W. Mayer,F.H. Eisen,B.M. Welch
DOI: https://doi.org/10.1016/0038-1101(77)90186-1
1977-03-01
Abstract:The dependence of carrier concentration and mobility profiles on the dose of 400 keV Se ions implanted into Cr-doped semi-insulating GaAs, and on the annealing temperature has been studied for doses ranging from 3 × 1012/cm2 to 2 × 1015/cm2 and for annealing temperatures between 800 and 1000°C. Sputtered aluminum oxy-nitride and silicon nitride films were used as encapsulants for protection of the implanted surface during annealing treatments. The carrier profiles exhibited deep tails for implantations along both random and {110} planar directions. It was found that annealing temperatures of 900°C or above were necessary to obtain high carrier density and mobility values for implantation doses above 1 × 1014/cm2. Samples encapsulated with aluminum oxy-nitride films exhibited 3 to 4 times higher carrier concentration values and also slightly higher mobility values than those encapsulated with silicon nitride films. The maximum carrier concentration obtained was about 4 × 1018/cm3 with aluminum oxy-nitride films as the encapsulant.
physics, condensed matter, applied,engineering, electrical & electronic
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