Abstract:Gyroscopes are one of the next killer applications for the MEMS (Micro-Electro-Mechanical-Systems) sensors industry. Many mature applications have already been developed and produced in limited volumes for the automotive, consumer, industrial, medical, and military markets. Plenty of high-volume applications, over 100 million per year, have been calling for low-cost gyroscopes. Bulk silicon is a promising candidate for low-cost gyroscopes due to its large scale availability and maturity of its manufacturing industry. Nevertheless, it is not suitable for a real monolithic IC integration and requires a dedicated packaging. New designs are supposed to eliminate the need for magnets and metal case package, and allow for a real monolithic MEMS-IC (Integrated Circuit) electronic system. In addition, a drastic cost reduction could be achieved by utilizing off-the-shelf plastic packaging with lead frames for the final assembly. The present paper puts forward the design of a novel tri-axial gyroscope based on rotating comb-drives acting as both capacitive sensors and actuators. The comb-drives are comprised of a single monolithic moving component (rotor) and fixed parts (stators). The former is made out of different concentrated masses connected by curved silicon beams in order to decouple the motion signals. The sensor was devised to be fabricated through the PolyMUMPs® process and it is intended for working in air in order to semplify the MEMS-IC monolithic integration.

Design And Validation Of The First Z-Axis Mems Accelerometer With In-Plane Readout

Mechanical Design Optimization of A Single-Axis Moems Accelerometer Based on A Grating Interferometry Cavity for Ultrahigh Sensitivity

An In-Plane Low-Noise Accelerometer Fabricated with an Improved Process Flow

Design of Freeform Geometries in a MEMS Accelerometer with a Mechanical Motion Preamplifier Based on a Genetic Algorithm

Monolithic Integrated Micro-Opto-Electromechanical Accelerometer Based on Michelson Interferometer Structure

Design And Implementation Of A Novel Cmos-Mems Single Proof-Mass Tri-Axis Accelerometer

A Wafer Level Vacuum Encapsulated Capacitive Accelerometer Fabricated in an Unmodified Commercial MEMS Process

Implementation of A Monolithic Single Proof-Mass Tri-Axis Accelerometer Using Cmos-Mems Technique

Development of A Z-Axis Out of Plane MEMS Accelerometer

3-axis Capacitive Low-Gravity MEMS Accelerometer with Zero Cross-Axis Sensitivity in a Commercial Process

A novel out-of-plane MEMS tunneling accelerometer

Design of a Tri-Axial Surface Micromachined MEMS Vibrating Gyroscope

Design and Test of MEMS Resonant Accelerometer with a Novel Die-Attach Structure

A Novel Soi Z-axis Accelerometer with Gap Closing Differential Sensing Electrodes

A Novel Mems 3-Axis Thermal Accelerometer with 5-Wire Structure Using Planar Stacking Method

Theoretical and numerical investigation of a new 3-axis SU-8 MEMS piezoresistive accelerometer

An Optical Interferometry Based MEMS Accelerometer Applicable to Seismic-Grade Measurement

Design and Fabrication of a Micro-Electromechanical System Sandwich Capacitive Accelerometer

Design, Manufacture And Test Of Novel Mems Piezoresistive Accelerometer For High G Application

Design of a Triaxial Piezoelectric Accelerometer

Micro-machined Resonant Out-of-plane Accelerometer with a Differential Structure Fabricated by Silicon-on-insulator–mems Technology