A Novel Mems 3-Axis Thermal Accelerometer with 5-Wire Structure Using Planar Stacking Method

Zhe Li,Wenhan Chang,Shoule Sun,Chengchen Gao,Yilong Hao
DOI: https://doi.org/10.1109/TRANSDUCERS.2019.8808669
2019-01-01
Abstract:This paper proposed a novel MEMS 3-axis thermal accelerometer for the first time. Two five-wire structures perpendicular to each other are fabricated using planar stacking method. Compared with other 3-axis thermal accelerometers, this accelerometer has simpler fabrication process and signal processing circuit, and the sensitive directions are orthogonal with almost the same sensitivities. For one of the five-wire structures, the sensitivities of the two orthogonal directions are 16.1mV/g and 18.4mV/g respectively. This accelerometer shows good linearity for a range about 0-6g acceleration at 20Hz.
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