Laser Machining at High ∼PW/cm2 Intensity and High Throughput

Nan Zheng,Ričardas Buividas,Hsin-Hui Huang,Dominyka Stonytė,Suresh Palanisamy,Tomas Katkus,Maciej Kretkowski,Paul R. Stoddart,Saulius Juodkazis
DOI: https://doi.org/10.3390/photonics11070598
IF: 2.536
2024-06-27
Photonics
Abstract:Laser machining by ultra-short (sub-ps) pulses at high intensity offers high precision, high throughput in terms of area or volume per unit time, and flexibility to adapt processing protocols to different materials on the same workpiece. Here, we consider the challenge of optimization for high throughput: how to use the maximum available laser power and larger focal spots for larger ablation volumes by implementing a fast scan. This implies the use of high-intensity pulses approaching ∼PW/cm2 at the threshold where tunneling ionization starts to contribute to overall ionization. A custom laser micromachining setup was developed and built to enable high speed, large-area processing, and easy system reconfiguration for different tasks. The main components include the laser, stages, scanners, control system, and software. Machining of metals such as Cu, Al, or stainless steel and fused silica surfaces at high fluence and high exposure doses at high scan speeds up to 3 m/s were tested for the fluence scaling of ablation volume, which was found to be linear. The largest material removal rate was 10 mm3/min for Cu and 20 mm3/min for Al at the maximum power 80 W (25 J/cm2 per pulse). Modified surfaces are color-classified for their appearance, which is dependent on surface roughness and chemical modification. Such color-coding can be used as a feedback parameter for industrial process control.
optics
What problem does this paper attempt to address?
The problem that this paper attempts to solve is: How to achieve efficient large - area, high - throughput laser processing by optimizing laser parameters and processing techniques while maintaining high precision. Specifically, the research focuses on the following aspects: 1. **Balance between high - throughput and high - precision**: - In material processing, there is usually a trade - off between resolution (precision) and throughput (efficiency). This paper aims to achieve material processing with both high resolution and high throughput. - By using ultrashort - pulse (sub - picosecond - level) lasers and high - intensity (about PW/cm²) pulses, researchers try to find a method to improve the processing speed and efficiency without sacrificing precision. 2. **Optimizing laser parameters**: - Researchers have developed and tested a custom - made laser micromachining system to achieve high - speed, large - area processing, and the system can be easily reconfigured to adapt to different tasks. - The focus is on how to use the maximum available laser power and a large focal spot for large - volume ablation while implementing fast scanning. This involves using high - intensity pulses close to the tunneling ionization threshold (about 1 PW/cm²). 3. **Material removal rate and surface characteristics**: - The ablation characteristics of metals (such as copper, aluminum, and stainless steel) and fused silica surfaces under high - throughput conditions have been studied. - The relationship between the ablation volume and the energy per pulse under different total exposure doses has been tested, and it has been found that the ablation volume increases linearly with the energy per pulse. - The research also explores the color classification of the processed surface. These colors depend on the surface roughness and chemical modification and can be used for industrial process control. 4. **Application prospects**: - This research shows how laser processing can be applied to cutting - edge scientific fields such as large - area patterned photo - electrodes and tunable visible - near - infrared light sources. - A flexible and low - cost femtosecond laser processing platform is proposed, which is suitable for the assembly and application of specific functions and has more advantages compared with commercial multi - function femtosecond laser processing stations. In summary, the core problem of this paper is to explore how to achieve efficient large - area, high - throughput laser processing by optimizing laser parameters and processing techniques while maintaining high precision, thereby providing new solutions for industrial applications.