Laser ablation and micromachining with ultrashort laser pulses

X. Liu,D. Du,G. Mourou
DOI: https://doi.org/10.1109/3.631270
IF: 2.5
1997-01-01
IEEE Journal of Quantum Electronics
Abstract:The mechanisms of ultrashort-pulse laser ablation of materials are discussed, and the differences to that of long laser pulses are emphasized. Ultrashort laser pulses offer both high laser intensity and precise laser-induced breakdown threshold with reduced laser fluence. The ablation of materials with ultrashort pulses has a very limited heat-affected volume. The advantages of ultrashort laser pulses are applied in precision micromachining of various materials. Some femtosecond laser pulse micromachining results, including comparison with long pulses, are presented. Ultrashort-pulse laser micromachining may have a wide range of applications where micrometer and submicrometer feature sizes are required.
engineering, electrical & electronic,optics,physics, applied,quantum science & technology
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