Implementing Remote Doping and Suppressed Scattering in MoS2 Field-Effect Transistor Using CMOS-Compatible Process

Weiming Ma,Tianjiao Zhang,Jiayang Hu,Yu Kang,Hanxi Li,Jiachao Zhou,Qian He,Hailiang Wang,Yang Xu,Yuda Zhao,Bin Yu
DOI: https://doi.org/10.1109/ted.2024.3382673
IF: 3.1
2024-04-27
IEEE Transactions on Electron Devices
Abstract:Doping technologies for 2-D materials, such as substitutional doping or molecular surface doping, inevitably introduce scattering caused by ionized dopants, resulting in carrier mobility degradation. Moreover, these processes are not CMOS-compatible and therefore hinder practical integration. In this study, we report the realization of remote doping and reduced carrier scattering in molybdenum disulfide (MoS2) field-effect transistor (FET) with silicon oxynitride/alumina (SiOxNy/AlOx) encapsulation layer fabricated by CMOS-compatible process. Charged dopants in SiOxNy remotely dope the underlying MoS2 channel by inserting a high- dielectric AlOx, keeping themselves spatially separated from the channel and contributing to an increase in carrier density and mobility. By depositing a charge modulation layer SiOxNy, it is possible to achieve an electron density change ( ) of cm . Additionally, the remotely doped MoS2 FETs exhibit improved contact and increased room-temperature mobility compared to the pristine MoS2 FETs. Furthermore, the temperature-dependent characterization of the remotely doped MoS2 FET demonstrates significant suppression of charged impurity scattering.
engineering, electrical & electronic,physics, applied
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