Implementing Remote Doping and Suppressed Scattering in MoS<inline-formula> ≪tex-Math Notation="latex">$_{\text{2}}$</tex-Math> ≪/inline-Formula> Field-Effect Transistor Using CMOS-Compatible Process

Weiming Ma,Tianjiao Zhang,Jiayang Hu,Yu Kang,Hanxi Li,Jiachao Zhou,Qian He,Hailiang Wang,Yang Xu,Yuda Zhao,Bin Yu
DOI: https://doi.org/10.1109/ted.2024.3382673
IF: 3.1
2024-01-01
IEEE Transactions on Electron Devices
Abstract:Doping technologies for 2-D materials, such as substitutional doping or molecular surface doping, inevitably introduce scattering caused by ionized dopants, resulting in carrier mobility degradation. Moreover, these processes are not CMOS-compatible and therefore hinder practical integration. In this study, we report the realization of remote doping and reduced carrier scattering in molybdenum disulfide (MoS (2) ) field-effect transistor (FET) with silicon oxynitride/alumina (SiO (x) N- y /AlO (x) ) encapsulation layer fabricated by CMOS-compatible process. Charged dopants in SiO x N y remotely dope the underlying MoS (2) channel by inserting a high- k dielectric AlO (x) , keeping themselves spatially separated from the channel and contributing to an increase in carrier density and mobility. By depositing a charge modulation layer SiO x N y , it is possible to achieve an electron density change ( Delta n ) of 2.2 x 10 12 cm (-2) . Additionally, the remotely doped MoS2 FETs exhibit improved contact and increased room-temperature mobility compared to the pristine MoS2 FETs. Furthermore, the temperature-dependent characterization of the remotely doped MoS 2 FET demonstrates significant suppression of charged impurity scattering
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