Influence of Electrical Discharge Texturing Upon Cooling Performance of a Downward-Faced Copper Surface

Athikkal Rakesh,Arivalagan Inbaoli,Charuvezhathu Sivaraman Sujith Kumar,Basil Kuriachen
DOI: https://doi.org/10.1080/01457632.2024.2317610
IF: 2.3
2024-02-23
Heat Transfer Engineering
Abstract:Enhancement of quenching heat transfer at film boing regime is one of the primary concerns in handling decay heat produced by downward-faced core catcher units in the nuclear industry. The present study focused on the enhancement of the quenching rate of a hemispherical downward-facing copper sample by the modification of the substrate surface using electrical discharge machining (EDM) texturing and the addition of trisodium phosphate (TSP) to the coolant. All quenching tests were carried out at 500 °C under atmospheric pressure. The influence of surface texturing and fluid additives on quenching rate and bubble dynamics has been investigated using cooling curves and visualization studies. The EDM textured boiling surface showed an improved cooling performance by the significant reduction in the quenching time compared to the bare surface. TSP added with deionized (DI) water showed an enhancement in the quenching rate compared to DI water. EDM surface with TSP exhibits better cooling performance compared to bare surface and DI water by yielding 75% enhancement in the overall cooling rate. Visualization studies were conducted to investigate the bubble dynamics during the quenching phenomenon under the influence of EDM textured surface and TSP.
engineering, mechanical,thermodynamics,mechanics
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