Liquid Super‐Spreading Boosted High‐Performance Jet‐Flow Boiling for Enhancement of Phase‐Change Cooling
Zhe Xu,Peng Zhang,Chuanghui Yu,Weining Miao,Qiankun Chang,Ming Qiu,Yulong Li,Ye Tian,Lei Jiang
DOI: https://doi.org/10.1002/adma.202210557
IF: 29.4
2023-04-08
Advanced Materials
Abstract:Enhanced boiling heat transfer via surface engineering is a topic of general interest for its great demand in industrial fields. However, as a dynamic interfacial phenomenon, deep understanding of its process and mechanism, including liquid re‐wetting and vapor departure, is still challenging. Herein, we design a micro‐/nanostuctured Cu surface containing periodic micro‐groove/pyramid array with rich nano‐wrinkles, where super‐spreading (<134.1 ms) of organic cooling agents highly boosts liquid re‐wetting process, causing a discontinuous solid‐liquid‐vapor three‐phase contact line and ultra‐low under‐liquid bubble adhesion force (∼1.3 μN). Therefore, a characteristic, ultra‐fast jet‐flow boiling (bubbles rapidly ejected in multiple strips) is obtained on this surface, giving a priority to nucleation (superheat ∼1.5 °C) and simultaneously enhancing the critical heat flux and heat‐transfer coefficient by up to 80% and 608%, respectively, compared with a flat surface. In situ observation and analysis of the nucleation, growth, and departure of micro‐sized jet‐flow bubbles reflects that micro‐grooves/pyramids with nano‐wrinkles promote the latent heat exchange process by super‐spreading induced ultra‐fast liquid re‐wetting and constant vapor film coalescing. Based on the designed structures, high‐performance phase‐change cooling for CPU heat management in supercomputer centers is accomplished with an ultra‐low power usage effectiveness (PUE<1.04). This article is protected by copyright. All rights reserved
materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,nanoscience & nanotechnology