Abstract:A computer is mainly composed of chips on which a large number of semiconductor switches are fabricated. The requirement for increasing signal speed in the computer has focused the efforts of electronics industry on designing miniaturized electronic circuits and highly integrated circuit densities in chips. The integration technologies, which have advanced to the very large scale integration (VLSI) level, lead to an increased power dissipation rate at the chip, module and system levels. Sophisticated electronic cooling technology is needed to maintain relatively constant component temperature below the junction temperature, approximately 85°C for most mainframe memory and logic chips. Investigations have demonstrated that a single component operating 10°C beyond this temperature can reduce the reliability of some systems by as much as 50% (Nelson, 1978). Traditionally, convection heat transfer from electronic hardware to the surroundings has been achieved through the natural, forced, or mixed convection of air; however, even with advances in air-cooling techniques, the improvements will not suffice to sustain the expected higher heat fluxes. As an effective and increasingly-popular alternative to air cooling, directly immersing the component in inert, dielectric liquid can remove a large amount of heat dissipation, of which pool and forced boiling possess the attractive attribute of large heat transfer coefficient due to phase change compared with single-phase. An ideal boiling performance should provide adequate heat removal within acceptable chip temperatures. Direct liquid cooling, involving boiling heat transfer, by use of dielectric liquids has been considered as one of the promising cooling schemes. Primary issues related to liquid cooling of microelectronics components are mitigation of the incipience temperature overshoot, enhancement of established nucleate boiling and elevation of critical heat flux (CHF). Treated surface has been found to have great potential in enhancement of boiling heat transfer from electronic, significantly reducing the chip surface temperature and increasing CHF. Treated surfaces are used for nucleate boiling enhancement by applying some micro-structures on the chip surface to make the surface capable of trapping vapour and keeping the nucleation sites active or increasing effective heat transfer area. Since the 1970s, a number of active studies have dealt with the enhancement of boiling heat transfer from electronic components by use of surface microstructures that were fabricated directly on a silicon chip or on a simulated chip. These include a sand-blasted and KOH treated surface (Oktay 1982), a “dendritic heat sink” (brush-like structure) (Oktay and

Acoustofluidics-assisted strategy of zinc oxide nanoarrays for enhancement of phase-change chip cooling

Acoustofluidic bubble-driven assisted functionalized nano-array coated micro pin-fins surface for efficient liquid-vapor phase change chip cooling

Boiling and quenching heat transfer advancement by nanoscale surface modification

Microfluidic Flow Synthesis of Al2O3 Nanofluids for Efficient Phase-Change Boiling Heat Transfer Enhancement of Electronic Devices

Liquid Super‐Spreading Boosted High‐Performance Jet‐Flow Boiling for Enhancement of Phase‐Change Cooling

Pool Boiling Enhancement Via Surface Engineering for Thermal Management

Microfluidic Controllable Production and Morphology-Independent Phase-Change Heat Transfer of Boehmite Nanofluids

An All-Metal Hollow Microstructure for Pool-Boiling Chip-Integrated Cooling Based on Electroplating

Microfluidic controllable synthesis and size-dependent flow boiling heat transfer of silica nanofluids

SUBCOOLED JET IMPINGEMENT BOILING ENHANCED BY POROUS SURFACE WITH MICROCOLUMN ARRAY

Preparation of Silicon Oxide Nanofluids Via Microfluidic for Enhanced Flow Boiling Heat Transfer

Coupling droplets/bubbles with a liquid film for enhancing phase-change heat transfer

EFFECT OF NANO-STRUCTURE COATING ON THERMAL PERFORMANCE OF THERMOSYPHON BOILING IN MICRO-CHANNELS

Enhanced Pool Boiling Performance On Micro-, Nano-, And Hybrid-Structured Surfaces

Enhanced Boiling Heat Transfer from Micro-Pin-Finned Silicon Chips

Design of micro-nano structures for counter flow diverging microchannel heat sink with extraordinarily high energy efficiency

Highly efficient pool boiling heat transfer on surfaces with zoned rose-petal-inspired hierarchical structures

A Mems-Based Microstructure Surface Providing Suspension Platforms to Bubbles for Efficient Boiling Heat Transfe

Flow Pattern Analysis and Heat Transfer Characteristics During Subcooled Flow Boiling in a Rectangular Microchannel on ZnO Microrod Surface

Enhanced Heat Transfer Using Wafer-Scale Crack-Free Well-Ordered Porous Structure Surface

COOLING PERFORMANCE OF NANOFLUIDS IN A MICROCHANNEL HEAT SINK