Optimizing temperature gradient for rapid fabrication of Cu/Sn/Cu full intermetallic compounds joints via vacuum thermal compression bonding

DOI: https://doi.org/10.1007/s10854-024-12604-6

2024-04-23

Journal of Materials Science Materials in Electronics

Abstract:This study employed an improved thermal compression bonding process with two temperature settings (180 °C/250 °C, 250 °C/250 °C) to rapidly fabricate the complete intermetallic compound joints. While observing and evaluating the microstructure and shear strength of the joints, the influence of holding time and temperature gradients on the growth and evolution of the interfacial IMCs were investigated. The results demonstrated that reducing the temperature gradient can mitigate the adverse effects caused by significant differences in IMC thickness, while an overall increase in system temperature accelerated IMC growth. Utilizing vacuum thermal compression bonding allowed the rapidly forming complete IMC joints within 15 to 30 min and suppressed the voids effectively. In comparison to traditional transient liquid phase bonding, the rate of full IMC joints formation was accelerated by a factor of 2 to 4, accompanied by an average shear strength enhancement ranging from 8.9 to 18.7%. Thus, vacuum thermal compression bonding demonstrates the potential for rapidly fabricating high-strength full IMC joints with the judicious selection of appropriate temperature conditions, representing a promising technological advancement.

engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter, applied