Abstract:Heat pumping through thermoelectric devices has many advantages over traditional cooling. However, their current efficiency is a limiting factor in their implementation. In this paper, we approach the non-convex topology optimization of thermoelectrical elements for cooling applications through the method of moving asymptotes (MMA) to improve their cooling capabilities per watt usage. The optimization problem is defined for a given power budget, aiming for the minimum temperature with a known heat pumping need. The introduction of power as a constraint justifies the introduction of the voltage gradient across the thermocouple as a design variable to maintain the thermoelectrical device in its optimum power-to-heat extraction ratio. To better understand the convergence of this non-convex problem, we present a two-variable analytical thermoelectric optimization model. This example provides information on how to select the penalty parameters used to scale the three material coefficients involved in the problem to obtain lower objective values and better convergence using MMA. The analytical model shows the non-convexity of the problem and provides the recommendation to use penalization coefficients of the form for the thermal conductivity, electrical conductivity, and Seebeck coefficients. We tested these penalization coefficients through optimizations of a model based on the 1MC10-031 commercial thermoelectric-cooler (TEC) using the finite element method (FEM). These penalization coefficients provided local minima without the need for volume constraints. With this procedure, we found designs that provided temperatures close to 10 degrees lower using 60% less semiconductor material volume compared to the initial design.

Computational study of pulse current and thermal stress on thermoelectric cooler

Advancing Cryogenic Electronic Cooling: A Case Study on Embedded Manifold Microchannels in Micromachined Joule-Thomson Coolers

An investigation on thermoelectric coolers operated with continuous current pulses

FEA for Steady-State Thermal Performance of PCR Thermal-Cycler Based on Thermoelectric Cooler

Experimental Study on Transient Cooling Characteristics of a Realistic Thermoelectric Module under a Current Pulse Operation

Experiment Investigation of A Two-Stage Thermoelectric Cooler under Current Pulse Operation

Optimization of A Trapezoid-Type Two-Stage Peltier Couples for Thermoelectric Cooling Applications

Design Optimization of Thermoelectric Cooling Systems for Applications in Electronic Devices

Numerical study of transient supercooling performance and thermal stress analysis of segmented annular thermoelectric cooler

Efficient Thermoelectric Cooler for Localized Cooling in Electronic Devices

A novel thermoelectric cooler with pores for improved thermal performance

Research on performance of new separated thermoelectric cooler at different pulse currents

Investigation of the impact of the thermoelectric geometry on the cooling performance and thermal—mechanic characteristics in a thermoelectric cooler

Investigation on performance of a new thermoelectric cooler with hot and cold side separation for suppressing Fourier effect

Performance enhancement of a novel thermoelectric self-cooling system for electronic devices

Numerical study on transient supercooling performance of annular thermoelectric cooler

Performance optimization of the transient thermoelectric cooling for the temperature control of the chip working under dynamic power

Numerical Examination of the Performance of a Thermoelectric Cooler with Peltier Heating and Cooling

A Model to Evaluate the Device-Level Performance of Thermoelectric Cooler with Thomson Effect Considered

Thermoelectric Coolers for Hotspot Thermal Management of 3D Stacked Chips

Enhancing the cooling performance of thermocouples: a power-constrained topology optimization procedure