A novel thermoelectric cooler with pores for improved thermal performance

N. Vijay Krishna,S. Manikandan

DOI: https://doi.org/10.1016/j.icheatmasstransfer.2024.107316

IF: 6.782

2024-02-21

International Communications in Heat and Mass Transfer

Abstract:One of the most promising electronic cooling options is the thermoelectric cooler (TEC). For large-scale cooling applications, the coefficient of performance (COP) is lower than typical vapor compression refrigeration systems. Improving the TEC's material properties or design can overcome these constraints. This study introduces pores in the thermoelement to improve TEC's thermal performance. The results show that, for the same boundary condition at varying input currents, the pores in the thermoelement caused TEC's cold side temperature to drop by 4 to 9 K. The minimum temperature under the no-pore and with pore conditions is 268 K and 264 K, respectively, at no load and 1.5 A. Furthermore, horizontal, vertical, and slanting pore orientations are also introduced, with horizontal having the best thermal performance. In addition, adding pores to the thermoelement reduces its length for a fixed cold side temperature. To achieve a cold side temperature of 284 K, the conventional thermoelement without a pore needs a length of 2 mm, and the one with a 0.2 mm radius pore needs only 1.15 mm. This reduces the volume of thermoelectric material used by the TEC. Finally, the research shows that adding pores to the thermoelement improves cooling and saves material.

thermodynamics,mechanics